Patents by Inventor Christopher Stender

Christopher Stender has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Back-contact thin film semiconductor device structures and methods for their production
    Patent number: 11398575
    Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: July 26, 2022
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Rekha Reddy, Christopher Stender
  • BACK-CONTACT THIN FILM SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR THEIR PRODUCTION
    Publication number: 20180294372
    Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
    Type: Application
    Filed: April 6, 2018
    Publication date: October 11, 2018
    Inventors: Christopher Youtsey, Rekha Reddy, Christopher Stender