Abstract: A system to control a trailer is disclosed. The trailer may be attached to a towing vehicle. The system may include a transceiver configured to receive road information, vehicle information and trailer information. The system may further include a processor configured to determine that a predefined condition may be met based on the received road information, the vehicle information, and the trailer information. The processor may be further configured to transmit a command signal to a trailer wheel control unit to activate a trailer wheel drive motor responsive to a determination that the predefined condition is met. The trailer wheel drive motor may be located in a trailer.

Abstract: A vehicle puddle lamp assembly including a housing, a lens coupled to the housing, and a printed circuit board mounted to the housing. At least one near-infrared light source to emit near-infrared light through the lens is coupled to the printed circuit board. A palm image sensor is also coupled to the printed circuit board. The palm image sensor is configured to detect a palm vein pattern illuminated by the near-infrared light and reflected from a user's palm through the lens.

Abstract: Probe systems for testing a device under test are disclosed herein. The probe systems include a platen that defines an upper surface, an opposed lower surface, and a platen aperture. The probe systems also include a chuck that defines a support surface configured to support a device under test. The probe systems further include a lower enclosure extending from the lower surface of the platen and an upper enclosure extending from the upper surface of the platen. The upper enclosure includes a side wall that defines a side wall aperture, and the side wall and the platen define an intersection angle of at least 30 degrees and at most 60 degrees. The probe systems also include a manipulator, a probe shaft arm, a probe assembly, a test head, and an electrical conductor.

Abstract: Probe systems for testing a device under test are disclosed herein. The probe systems include a platen that defines an upper surface, an opposed lower surface, and a platen aperture. The probe systems also include a chuck that defines a support surface configured to support a device under test. The probe systems further include a lower enclosure extending from the lower surface of the platen and an upper enclosure extending from the upper surface of the platen. The upper enclosure includes a side wall that defines a side wall aperture, and the side wall and the platen define an intersection angle of at least 30 degrees and at most 60 degrees. The probe systems also include a manipulator, a probe shaft arm, a probe assembly, a test head, and an electrical conductor.

Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Abstract: Wafer-handling end effectors and semiconductor manufacturing devices that include and/or are utilized with wafer-handling end effectors are disclosed herein. The end effectors include an end effector body and a plurality of wafer-contacting surfaces that is supported by the end effector body and configured to form an at least partially face-to-face contact with a wafer. The end effectors further include a vacuum distribution manifold that extends between a robot-proximal end of the end effector body and the plurality of wafer-contacting surfaces. The end effectors also include a plurality of vacuum openings that is defined within the plurality of wafer-contacting surfaces and extends between the plurality of wafer-contacting surfaces and the vacuum distribution manifold. The end effectors further include a plurality of sealing structures each of which is associated with a respective one of the plurality of wafer-contacting surfaces.

Abstract: An adapter conductively interconnects a chuck of a probe station and an instrument. The adapter includes a signal conductor conductively connected to the chuck and selectively connectable to a respective one of a ground potential, a bayonet connector output and a signal connection for the instrument. A guard potential conductor conductively connected to the chuck and selectively connectable to a one of a ground potential and a guard connection for the instrument; and a shield conductor connected to a ground potential.

Abstract: An adapter conductively interconnects a chuck of a probe station and an instrument. The adapter includes a signal conductor conductively connected to the chuck and selectively connectable to a respective one of a ground potential, a bayonet connector output and a signal connection for the instrument. A guard potential conductor conductively connected to the chuck and selectively connectable to a one of a ground potential and a guard connection for the instrument; and a shield conductor connected to a ground potential.