Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.

Abstract: A system for storing data includes a discrete cooling module that can enable discrete cooling of mass storage devices installed in the chassis interior of a data storage module coupled to a rack. The discrete cooling module includes an air moving device and an air cover. The air moving device can induce and airflow through the chassis interior of the data storage module to remove heat from heat producing components of mass storage devices installed in the chassis interior. The air cover directs the airflow through the chassis interior. The discrete cooling module can isolate rotational vibrations generated by the air moving device from the mass storage devices installed in the chassis. Partial isolation can include indirectly coupling the discrete cooling module to the chassis via directly coupling with the rack.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: An electronic device includes persistent storage enclosed within a housing. The housing is configured to protect the persistent storage during shipment of the electronic device by a common carrier. The electronic device may include at least one security door, which when in an open-state, may provide access to at least one of a data port, an aperture, a portion of a display, and/or the persistent storage. When the security door is in a closed-state and possibly locked, the persistent storage may be protected from environmental factors, such as dirt, weather, and tampering. In some embodiments, the aperture may enable airflow though the housing and may be fitted with a filter to remove debris from air that circulates into the housing.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: Retention mechanisms for retaining compute components within server racks are described. In one example, a retention mechanism includes a latching component configured to move between a locked position and an unlocked position. The retention mechanism also includes a retaining component configured to position the latching component in the unlocked position. Movement of the retaining component releases the latching component thereby allowing the latching component to move into the locked position.

Abstract: A datacenter component rack may be used to mount electronic components. The datacenter component rack may include support surfaces which are evenly spaced on each side of the component rack. The support surfaces may form uniform slots for receiving the electronic components. The electronic components may include flanges for mounting the electronic components in the uniform slots. The flanges may be on each side of the electronic component and engage the support surfaces in the datacenter component rack. The flanges may support the electronic component after they have engaged with the support surfaces.

Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.

Abstract: A rack computer system can provide data indicating electrical power consumption by separate sets of the mass storage devices, including separate individual mass storage devices, of the rack computer system. A power sensor can be electrically coupled to a power transmission line for each mass storage device. The power sensor can be coupled to the power transmission line externally to the mass storage device. The power sensor can be an internal power sensor of the mass storage device, where a mass storage device microcontroller transmits internally-generated data to an external power monitoring system. A microcontroller can transmit the data to a baseboard management controller via a side-band connection between the mass storage device and the controller. The data can be transmitted via an in-band connection between a baseboard management controller and an instance of firmware which accesses internally-generated data from mass storage device microcontrollers.

Abstract: A server system includes a server chassis with one or more composite walls that provide structural stiffness for the server chassis. The one or more composite walls also include one or more air passages that permit air to flow through the composite walls. Each composite wall comprises at least two plates and one or more spacing devices that separate the at least two plates. Air passages are included in the composite wall between the at least two plates separated by the spacing devices and one or more openings permit air flowing through the air passages of the composite wall to flow out of the composite wall and across server devices mounted in the server chassis that includes the composite wall.

Abstract: A server rack comprises a plurality of slots and a plurality of computing devices. Individual ones of the computing devices are mounted within individual ones of the slots. The server rack also comprises a plurality of slot-level thermal regulation systems. At least one of the slot-level thermal regulation systems comprises a louver corresponding to a particular slot and located between a particular computing device mounted within the particular slot and at least one fan configured to facilitate airflow through the server rack. The louver is configured to regulate airflow through the particular computing device. The at least one slot-level thermal regulation system further comprises a thermally activated unit located in an exhaust flow of the particular computing device and configured to change the angle of the louver in response to a change in thermal energy of the exhaust flow.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes a chassis with one or more arrays of devices in the chassis. Each array includes mass storage devices and a server device mounted in the array within the chassis of the server system. The server device occupies no more than an equivalent volume of space in the chassis as one of the mass storage devices. A set of mass storage devices of an array and the server device of the array form a logical node, and a server system may include multiple logical nodes in the same chassis. Each array of devices may be located in a sled that can move into and out of the chassis of the server system.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

Abstract: Latching components for retaining rack component cases within server racks are described. In one example, a latching component is installed at an interior surface of a rack component case. The latching component includes a protrusion. The latching component is biased in a locked position in which the protrusion is outside the rack component case. The latching component is moveable from the locked position to an unlocked in which the protrusion is removed from outside the rack component case using an unlatching component.

Abstract: A rack-mountable computer system directs separate portions of a cooling airflow from an inlet air plenum in the computer system interior through separate air passages to remove heat from separate portions of a set of heat-producing components. The air passages can preclude a portion of cooling airflow removing heat from a component from being preheated by another component. Plenums and air passages can be established through the arrangement of components in the interior. Components can be arranged in progressive offsets throughout the depth of the interior to vary plenum flow area throughout the depth, which can progressively impede and redirect airflow through the inlet plenum into the air passages. Arrangements can include an angled row, a staggered configuration, etc. The computer system can include a chassis which can translate, while maintaining operation of hot-pluggable electronic components coupled throughout the depth, to enable swapping of hot-pluggable electronic components throughout the interior.