Abstract: A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.

Abstract: The present invention relates to a semiconductor cooling arrangement for cooling semiconductor devices, such as power semiconductors. The semiconductor cooling arrangement comprises one or more semiconductor assemblies located in a chamber within a housing. The housing comprises inlet and outlet ports for receiving and outputting a cooling medium. The chamber is flooded with a cooling medium to cool the assemblies. The assemblies themselves each comprise a heatsink and one or more semiconductor power devices thermally coupled to the heatsink. The heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from one surface to another surface such that the cooling medium flows through the holes to extract heat from the heatsink.

Abstract: A semiconductor arrangement and an inverter incorporating the semiconductor arrangement, in particular to an inverter for use with traction power units e.g. for on and off road vehicles and stationary power inversion, are described. In the arrangement, semiconductor devices are thermally and electrically coupled to a heatsink as a module. The heatsink is configured as a bus bar to electrically connect the one or more semiconductor devices together to transmit power between the one or more semiconductor devices. The semiconductor devices may be cooled using the structure to which they are attached, and also immersed in a cooling medium to further increase the cooling of the device.

Abstract: The present invention relates to a semiconductor cooling arrangement for cooling semiconductor devices, such as power semiconductors. The semiconductor cooling arrangement comprises one or more semiconductor assemblies located in a chamber within a housing. The housing comprises inlet and outlet ports for receiving and outputting a cooling medium. The chamber is flooded with a cooling medium to cool the assemblies. The assemblies themselves each comprise a heatsink and one or more semiconductor power devices thermally coupled to the heatsink. The heatsink comprises heat exchanging elements in the form of a plurality of holes in the heatsink extending through the heatsink from one surface to another surface such that the cooling medium flows through the holes to extract heat from the heatsink.