Abstract: A magnetic component, like an amorphous metal ribbon component, is disposed within an aperture of a layer of circuit board substrate, like FR4 or a flexible substrate. That layer is then laminated between a top and bottom layer to form a circuit substrate with a magnetic component integrally formed therein. Conductive traces are disposed on the top layer and bottom layer. These conductive traces are coupled together about the magnetic component with conductive vias. The top traces, bottom traces and conductive vias form a “winding” about the magnetic component. The resultant assembly is a single, multi-layered circuit substrate with a magnetic circuit element integrally formed therein. The magnetic circuit component is suitable for use as, amongst other things, an inductor, a transformer, or a contactless charging primary or secondary coil.