Patents by Inventor Christopher Valdivia

Christopher Valdivia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical power transfer devices with an embedded active cooling chip
    Patent number: 10901161
    Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: January 26, 2021
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., UNIVERSITY OF OTTAWA, BROADCOM INC.
    Inventors: Ercan M. Dede, Christopher Valdivia, Matthew Wilkins, Karin Hinzer, Philippe-Olivier Provost, Denis Masson, Simon Fafard
  • OPTICAL POWER TRANSFER DEVICES WITH AN EMBEDDED ACTIVE COOLING CHIP
    Publication number: 20200091677
    Abstract: An optical power transfer device with an embedded active cooling chip is disclosed. The device includes a cooling chip made of a semiconductor material, and a first subassembly and a second subassembly mounted on the cooling chip. The cooling chip comprises at least one metallization layer on a portion of a first surface of the cooling chip, at least one inlet through a second surface of the cooling chip, wherein the second surface is opposite to the first surface, at least one outlet through the second surface and one or more micro-channels extending between and fluidly coupled to the at least one inlet and the at least one outlet. A cooling fluid flows through the one or more micro-channels. The first subassembly is mounted on the at least one metallization layer and comprises a laser. The second subassembly comprises a phototransducer configured to receive a laser beam from the laser.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., University of Ottawa, Broadcom Inc.
    Inventors: Ercan M. Dede, Christopher Valdivia, Matthew Wilkins, Karin Hinzer, Philippe-Olivier Provost, Denis Masson, Simon Fafard