Patents by Inventor Christopher Vernon Smith

Christopher Vernon Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6768316
    Abstract: A laminate comprising an insulation layer sandwiched between a pair of electrically conductive layers is prepared for electrical insulation testing by using a laser to remove a strip from at least one of the conductive layers proximate the edge of the laminate to electrically isolate a central, bulk portion of the conductive layer from the edges of the laminate. Conductive material that may be smeared across an edge of the laminate will not therefore provide an electrical short between the portion of the conductive layer surrounded by the slot and the second conductive layer on the opposite side of the insulation layer.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: July 27, 2004
    Assignee: Polyclad Laminates, Inc.
    Inventors: Yeo Kong Hoo, Christopher Vernon Smith
  • Publication number: 20040115405
    Abstract: A laminate comprising an insulation layer sandwiched between a pair of electrically conductive layers is prepared for electrical insulation testing by using a laser to remove a strip from at least one of the conductive layers proximate the edge of the laminate to electrically isolate a central, bulk portion of the conductive layer from the edges of the laminate. Conductive material that may be smeared across an edge of the laminate will not therefore provide an electrical short between the portion of the conductive layer surrounded by the slot and the second conductive layer on the opposite side of the insulation layer.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Inventors: Yeo Kong Hoo, Christopher Vernon Smith
  • Patent number: 6609294
    Abstract: A novel process for fabricating metal clad laminates used in the manufacture of printed wiring boards. The process which eliminates multiple use separator plates within laminate books during buildup and pressing, utilizes a sacrificial separator sheet between copper sheets and wherein the separator sheet remains intact throughout the pressing and cutting steps and is finally removed after the laminates have been sized to the desired dimensions. This process provides time and cost savings, as well as a significant increase in quality and quantity of the laminates produced.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: August 26, 2003
    Assignee: Polyclad Laminates, Inc.
    Inventors: Christopher Vernon Smith, Richard Allen Correia, Ed Carignan