Patents by Inventor Christopher W. Braun

Christopher W. Braun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILTRATION SEALING SYSTEM
    Publication number: 20240082760
    Abstract: A inflation sealing system is provided for sealing a filter element in a housing at a mating interface therebetween. The sealing system includes a keyed interface. A replacement filter element is provided for such filtration sealing system, with the replacement filter element including a keyed interface.
    Type: Application
    Filed: November 13, 2023
    Publication date: March 14, 2024
    Applicant: CUMMINS FILTRATION IP, INC.
    Inventors: Caryn J. KINDKEPPEL, Brian W. Schwandt, Thomas J. Braun, Christopher E. Holm, Pathikrit T. Banerjee, Buwa A. Baldeh
  • Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
    Patent number: 9425163
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: August 23, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
  • SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS
    Publication number: 20150380380
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
    Type: Application
    Filed: August 7, 2015
    Publication date: December 31, 2015
    Inventors: Michael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
  • Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
    Patent number: 9136243
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: September 15, 2015
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun
  • SYSTEMS AND METHODS FOR DETERMINING AND ADJUSTING A LEVEL OF PARALLELISM RELATED TO BONDING OF SEMICONDUCTOR ELEMENTS
    Publication number: 20150155254
    Abstract: A bonding machine for bonding semiconductor elements, the bonding machine including: a support structure configured to support a substrate; a bond head assembly, the bond head assembly including a bonding tool configured to bond a plurality of semiconductor elements to the substrate; and a calibration tool including a contact portion configured to be positioned between the bonding tool and the support structure, the contact portion configured to be contacted by each of the bonding tool and the support structure simultaneously during a calibration operation.
    Type: Application
    Filed: November 25, 2014
    Publication date: June 4, 2015
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Michael P. Schmidt-Lange, Matthew B. Wasserman, Christopher W. Braun