Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

Abstract: A brace assembly for an electronic equipment enclosure which may include a door is disclosed. The brace assembly may include a frame, a plurality of deadbolt assemblies and a plurality of catch rails. The frame may enclose a plurality of rigidly attached cross-members, and may fit within a perimeter of the door and attach to a face of the door. The plurality of deadbolt assemblies may be attached to the frame, and each deadbolt assembly may include a deadbolt. The plurality of catch rails may be configured to attach to the electronic equipment enclosure, and the catch rails may have recesses defined to receive a plurality of deadbolts when the door is in a closed position, and the deadbolts are in a latched position, thereby providing seismic bracing.

Abstract: A first interconnect card is configured, wherein a first controller is included in the first interconnect card. A second interconnect card coupled to the first interconnect card is configured, wherein a second controller is included in the second interconnect card. In response to a failure of the first controller included in the first interconnect card, the first interconnect card is controlled via the second controller included in the second interconnect card. In response to a failure of the second controller included in the second interconnect card, the second interconnect card is controlled via the first controller included in the first interconnect card.

Abstract: The invention relates to an electromagnetic control (EMC) contact strip. In one embodiment, the strip is mounted to an electrically conductive surface which is adapted to slide in a direction into and out of engagement with another electrically conductive surface. The strip has a base having a length, and a contact formed along the length of the base and defined by a plurality of inverted V-shaped members projecting therefrom. The inverted V-shaped members are compressible in a direction towards the base upon application of a force against the inverted V-shaped members in a direction substantially perpendicular to the length of the base.