Abstract: The subject technology is directed to a semiconductor device. In an embodiment, the semiconductor device comprises an interposer, which comprises a first side and a second side. The first side is opposite the second side. The device further comprises a first circuit coupled to the first side and a second circuit coupled to the second side. The device further comprises a first layer coupled to the first circuit and a second layer coupled to the second circuit. The second layer is configured to dissipate heat generated by the second circuit. This configuration enhances thermal management by providing a direct thermal path for heat dissipation, improving the overall efficiency and reliability of the semiconductor device. Additionally, the elimination of thermal vias simplifies the PCB layout, allowing for more compact and cost-effective designs.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving an authentication request from a first user device. A second user device may send a request for and receive a public key of the first user device and receive. The second user device may verify the authentication request using the public key of the first user device and perform authentication based on an authentication secret received from a user.

Abstract: Systems and techniques are provided for booting an electronic device. For example, a process can include initiating a boot procedure for the electronic device. The process can also include determining a hardware pseudo-random number generator (PRNG) is inoperable, obtaining a seed value from a read-only memory, based on the determination that the hardware PRNG is inoperable, initiating a software PRNG based on the seed value, obtaining a pseudo-random number from the software PRNG, and continuing the boot procedure using the obtained pseudo-random number.

Abstract: Systems and techniques are provided for booting an electronic device. For example, a process can include initiating a boot procedure for the electronic device. The process can also include determining a hardware pseudo-random number generator (PRNG) is inoperable, obtaining a seed value from a read-only memory, based on the determination that the hardware PRNG is inoperable, initiating a software PRNG based on the seed value, obtaining a pseudo-random number from the software PRNG, and continuing the boot procedure using the obtained pseudo-random number.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving an authentication request from a first user device. A second user device may send a request for and receive a public key of the first user device and receive. The second user device may verify the authentication request using the public key of the first user device and perform authentication based on an authentication secret received from a user.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving an authentication request from a first user device. A second user device may send a request for and receive a public key of the first user device and receive. The second user device may verify the authentication request using the public key of the first user device and perform authentication based on an authentication secret received from a user.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving an authentication request from a first user device. A second user device may send a request for and receive a public key of the first user device and receive. The second user device may verify the authentication request using the public key of the first user device and perform authentication based on an authentication secret received from a user.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving a request from a user to access one or more resources via a first device. In response to receiving the request to access the one or more resources, the first device may send, e.g., to a second device, a request for user input of a credential at the second device. The first device may receive a credential from the second device, and the first device may authenticate the user based on the received credential. Additionally or alternatively, the second device may authenticate the user based on an input of a user credential, and the second device may send an indication of a successful authentication to the first device.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving a request from a user to access one or more resources via a first device. In response to receiving the request to access the one or more resources, the first device may send, e.g., to a second device, a request for user input of a credential at the second device. The first device may receive a credential from the second device, and the first device may authenticate the user based on the received credential. Additionally or alternatively, the second device may authenticate the user based on an input of a user credential, and the second device may send an indication of a successful authentication to the first device.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving a request from a user to access one or more resources via a first device. In response to receiving the request to access the one or more resources, the first device may send, e.g., to a second device, a request for user input of a credential at the second device. The first device may receive a credential from the second device, and the first device may authenticate the user based on the received credential. Additionally or alternatively, the second device may authenticate the user based on an input of a user credential, and the second device may send an indication of a successful authentication to the first device.

Abstract: Methods, systems, computer-readable media, and apparatuses for providing testing environments using virtualization are presented. In one or more embodiments, a computer system may receive, from a client computing device, a software application. Subsequently, the computer system may receive, from the client computing device, a set of one or more testing parameters for testing the software application. Then, the computer system may create, based on the set of one or more testing parameters for testing the software application, a testing environment for the software application using a native hardware layer that represents hardware on which the software application is configured to be executed. Thereafter, the computer system may initiate a testing session in which software application is executed in the testing environment. Subsequently, the computer system may provide, to the client computing device, a control interface for controlling the testing session.

Abstract: Methods and systems for authenticating a user requesting to access one or more resources via a device are described herein. Authentication may be based on or otherwise rely on a plurality of devices. For example, aspects described herein are directed towards a system and method for receiving a request from a user to access one or more resources via a first device. In response to receiving the request to access the one or more resources, the first device may send, e.g., to a second device, a request for user input of a credential at the second device. The first device may receive a credential from the second device, and the first device may authenticate the user based on the received credential. Additionally or alternatively, the second device may authenticate the user based on an input of a user credential, and the second device may send an indication of a successful authentication to the first device.

Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

Abstract: Methods, systems, computer-readable media, and apparatuses for providing testing environments using virtualization are presented. In one or more embodiments, a computer system may receive, from a client computing device, a software application. Subsequently, the computer system may receive, from the client computing device, a set of one or more testing parameters for testing the software application. Then, the computer system may create, based on the set of one or more testing parameters for testing the software application, a testing environment for the software application using a native hardware layer that represents hardware on which the software application is configured to be executed. Thereafter, the computer system may initiate a testing session in which software application is executed in the testing environment. Subsequently, the computer system may provide, to the client computing device, a control interface for controlling the testing session.

Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

Abstract: A method is provided for manufacturing a multilayer substrate. An insulating layer can have a hole overlying a patterned second metal layer. In turn, the second metal layer can overlie a first metal layer. A third metal layer can be electroplated onto the patterned second metal layer within the hole, the third metal layer extending from the second metal layer onto a wall of the hole. When plating the third metal layer, the first and second metal layers can function as a conductive commoning element.

Abstract: A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overly/ing the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole. The upper unit may include an upper unit encapsulant that covers the connections of the upper unit and the one or more upper unit chips.

Abstract: An electronic device. The electronic device includes a first electrode and a coating layer. The electronic device is fabricated on a substrate; the substrate has a cavity created in a top surface of the substrate; and the first electrode is electrically coupled to the substrate. The coating layer coats at least part of a substrate surface in the cavity, and the presence of the coating layer results in a mitigation of at least one parasitic leakage path between the first electrode and an additional electrode fabricated on the substrate.