Abstract: An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

Abstract: An electronic assembly includes an interposer assembly and a cable connector module coupled to the interposer assembly. The interposer assembly includes an array of compressible interposer contacts each having upper and lower mating interfaces defining separable mating interfaces. The cable connector module includes a cable connector having a module substrate including module contacts at a bottom of the module substrate coupled to the upper mating interfaces of the corresponding interposer contacts. The cable connector module includes a backshell including a backshell cavity that receives the cable connector. The backshell includes a compression member engaging the cable connector and pressing the cable connector in the direction of the interposer assembly to compress the interposer contacts.

Abstract: A communication system includes a circuit board assembly including a mating circuit board having a mating edge and a plurality of mating pads at the mating edge, the circuit board assembly having an electrical component electrically coupled to the mating circuit board. The communication system includes a cable receptacle connector removably coupled to the mating edge of the mating circuit board. The cable receptacle connector includes a connector housing having a connector cavity and a card slot. A cable extends from the connector housing. The cable receptacle connector includes signal contacts each having a mating end mated with the corresponding mating pads and a terminating end electrically connected to a cable conductor of the cable.

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package.

Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

Abstract: An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package.

Abstract: A pluggable module is provided and includes a pluggable body including a cavity. The pluggable body extends between a mating end and a cable end opposite the mating end. The mating end is configured to be plugged into a receptacle connector assembly. The pluggable body has a top wall, a bottom wall, a first side wall at a first side, and a second side wall at a second side. The pluggable module includes a cable assembly coupled to the pluggable body. The cable assembly includes an upper module circuit card, a lower module circuit card, upper cables terminated to the upper module circuit card and lower cables terminated to the lower module circuit card. The upper module circuit card includes upper contact pads proximate to an upper mating edge. The lower module circuit card includes lower contact pads proximate to a lower mating edge.

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

Abstract: An electronic assembly includes an electronic package including a package substrate and an integrated circuit component mounted to an upper surface. The electronic package includes upper package contacts electrically connected to the integrated circuit component. The electronic assembly includes an interposer assembly including an array of compressible interposer contacts each having upper and lower mating interfaces. The interposer assembly defining a separable interface. The electronic assembly includes optical modules coupled to the separable interface of the interposer assembly and having an optical module substrate having module contacts and an optical engine mounted to the optical module substrate electrically connected to the module contacts. The optical module is mounted to the interposer assembly such that the module contacts are electrically connected to the upper mating interfaces of the interposer contacts. Each optical module includes at least one optical fiber terminated to the optical engine.

Abstract: A socket connector assembly for a communication system includes a socket connector having a socket housing holding socket contacts having deflectable spring beams. The socket connector assembly includes a cable assembly coupled to the socket connector having an outer housing holding a paddle card with paddle card contacts interfacing with the separable mating interfaces of the socket contacts. The cable assembly includes cables terminated to the paddle card coupled to corresponding paddle card contacts. The socket connector assembly includes a spring plate coupled to the outer housing secured to the host circuit board to press the cable assembly downward toward the host circuit board to compress the deflectable spring beams of the socket contacts.

Abstract: An optoelectronic assembly includes an optical module assembly including a fiber optic connector and an optical engine on an optical engine substrate. The fiber optic connector has a ferrule holding optical fibers optically coupled to the optical engine. The optical engine substrate includes a contact array of optical engine contacts at a bottom of the optical engine substrate. The optical module assembly includes a heat transfer element thermally coupled to the optical engine. The optical module assembly includes a backshell configured to be coupled to a circuit board. The backshell holds the heat transfer element in thermal contact with the optical engine. The optoelectronic assembly includes an interposer assembly electrically connected to the contact array of optical engine contacts having compressible interposer contacts with separable mating interfaces.

Abstract: An optoelectronic assembly includes an optical module assembly including a fiber optic connector and an optical engine on an optical engine substrate. The fiber optic connector has a ferrule holding optical fibers optically coupled to the optical engine. The optical engine substrate includes a contact array of optical engine contacts at a bottom of the optical engine substrate. The optical module assembly includes a heat transfer element thermally coupled to the optical engine. The optical module assembly includes a backshell configured to be coupled to a circuit board. The backshell holds the heat transfer element in thermal contact with the optical engine. The optoelectronic assembly includes an interposer assembly electrically connected to the contact array of optical engine contacts having compressible interposer contacts with separable mating interfaces.

Abstract: A card edge connector includes a housing having upper and lower card slots receiving upper and lower module circuit cards of a pluggable module. The card edge connector includes a contact assembly having a contact positioner holding upper and lower contacts. A guide feature guides mating of the contact assembly in the housing. A latching feature latchably secures the contact assembly to the housing. The upper contacts are arranged in first and second upper contact arrays. The lower contacts are arranged in first and second lower contact arrays. Contact tails of the upper and lower contacts are positioned at the bottom of the housing for surface mounting to the host circuit board.

Abstract: A communication system includes a receptacle connector assembly including a receptacle cage and a communication connector having an inner receptacle connector and an outer receptacle connector. The communication system includes a pluggable module received in the receptacle cage to mate with the communication connector. The pluggable module includes a pluggable body defining a module cavity. The pluggable module includes a module circuit board having mating pads at a mating edge of the module circuit board plugged into the inner receptacle connector and connector pads at a mounting location remote from the mating edge. The pluggable module includes a plug connector mounted to the mounting location. The plug connector includes plug contacts extending between a plug mating end and a plug mounting end. The plug mating end is plugged into the outer receptacle connector.

Abstract: An electronic assembly includes an electronic package having an integrated circuit component and interposer assemblies with compressible interposer contacts electrically connected thereto. Cable connector modules are coupled to the interposer assemblies. A cover assembly is coupled to the upper surface of the electronic package over the cable connector modules. The cover assembly includes bridge assemblies having plates in a plate stack that are independently movable. A load plate engages upper edges of the plates of the bridge assemblies and press against the plates to drive the bridge assemblies into the cable connector modules using compression hardware. The cable connector modules compress the interposer contacts of the interposer assemblies when the load plate presses the plates of the bridge assemblies into the cable connector modules.

Abstract: In one embodiment, a pluggable module is provided. The pluggable module includes a pluggable body having a top wall, a bottom wall, a first side wall and a second side wall. The pluggable body has a cavity. The pluggable body extends between a mating end and a cable end. An upper module circuit card is received in the cavity. The upper module circuit card has a mating edge at a mating end configured to be loaded into an upper card slot of a card edge connector and a cable end opposite the mating end. The upper module circuit card includes first upper contact pads on an upper surface of the upper module circuit card at the mating end. The upper module circuit card includes second upper contact pads on a lower surface of the upper module circuit card at the mating end. The upper module circuit card includes first upper cable termination areas on the upper surface of the upper module circuit card at the cable end.

Abstract: A communication system includes a receptacle connector assembly including a receptacle cage and a communication connector having an inner receptacle connector and an outer receptacle connector. The communication system includes a pluggable module received in the receptacle cage to mate with the communication connector. The pluggable module includes a pluggable body defining a module cavity. The pluggable module includes a module circuit board having mating pads at a mating edge of the module circuit board plugged into the inner receptacle connector and connector pads at a mounting location remote from the mating edge. The pluggable module includes a plug connector mounted to the mounting location. The plug connector includes plug contacts extending between a plug mating end and a plug mounting end. The plug mating end is plugged into the outer receptacle connector.

Abstract: In one embodiment, a pluggable module is provided. The pluggable module includes a pluggable body having a top wall, a bottom wall, a first side wall and a second side wall. The pluggable body has a cavity. The pluggable body extends between a mating end and a cable end. An upper module circuit card is received in the cavity. The upper module circuit card has a mating edge at a mating end configured to be loaded into an upper card slot of a card edge connector and a cable end opposite the mating end. The upper module circuit card includes first upper contact pads on an upper surface of the upper module circuit card at the mating end. The upper module circuit card includes second upper contact pads on a lower surface of the upper module circuit card at the mating end. The upper module circuit card includes first upper cable termination areas on the upper surface of the upper module circuit card at the cable end.