Abstract: There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.

Abstract: In example implementations, a method for producing a coating is provided. The method includes placing a magnesium substrate into an anodizing bath, applying a voltage for a first amount of time to form a micro-porous anodizing layer having a thickness of between 1 to 50 microns on the magnesium substrate, placing the magnesium substrate with the micro-porous anodizing layer in plating bath, wherein the plating bath comprises a metal and a complexing agent with a pH between 8 and 14, applying a first current to the plating bath for a second amount of time to form an interlock layer on the micro-porous anodizing layer, and applying a second current to the plating bath for a third amount of time to form a coating on the interlock layer.

Abstract: In example implementations, a method for coloring an alloy is provided. The method includes anodizing a substrate in an anodizing bath comprising phosphoric acid, at a constant temperature and a constant voltage for a first time period to develop an anodizing layer that includes a barrier layer, reducing the constant voltage applied to the anodizing bath for a second time period to change a thickness of the barrier layer and change a width of pores in the anodizing layer, plating the substrate in a plating bath at a first current that is increased over a third time period in accordance with a current profile of the plating bath, and plating the substrate in the plating bath at a second current for a fourth time period.

Abstract: In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.

Abstract: In example implementations, a method for producing a thin film coating is provided. The method includes pre-treating a substrate, placing the substrate in a bath comprising at least phosphoric acid and sulphuric acid to produce a thin anodized layer, rinsing the thin anodized layer in a solution, plating a surface of the thin anodized layer in an electro deposition bath following a plating current profile for a predetermined period, and increasing the plating current to the recommended bath plating current to produce the thin film coating having a desired initial coating thickness.