Patents by Inventor Christopher Youtsey

Christopher Youtsey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923617
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film III-V compound solar cell before it is separated from the substrate. To separate the thin film III-V compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film III-V compound solar cell.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: February 16, 2021
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Glen Hillier, Duy Phach Vu, Rao Tatavarti, Christopher Youtsey, David McCallum, Genevieve Martin
  • Patent number: 10685843
    Abstract: Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: June 16, 2020
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Robert McCarthy
  • Patent number: 10522363
    Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: December 31, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Christopher Youtsey, Robert McCarthy, Rekha Reddy
  • Publication number: 20190322376
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: February 22, 2019
    Publication date: October 24, 2019
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20190088495
    Abstract: Methods and systems for forming a device structure free of a substrate are described. Exemplary embodiments include a device structure comprising of device layers, a release layer, an etch stop layer, and a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device layers from the substrate. The device structure can include a contact layer, an etch stop layer, or both in some embodiments.
    Type: Application
    Filed: July 24, 2018
    Publication date: March 21, 2019
    Inventors: Christopher Youtsey, Robert McCarthy, Rekha Reddy
  • Publication number: 20190088494
    Abstract: Methods and systems for etching a substrate using photoenhanced wet etching techniques are described. At least one light emitting diode source is used to create a high intensity of ultraviolet light at the surface of the substrate or at one or more layers formed on the substrate. Etching rates in GaN substrates and GaN layers are improved by an order of magnitude over conventional systems. Systems and methods for forming a device structure free of a substrate are described. The device structure is grown or applied over a release layer on a substrate. The device structure is exposed to photoenhanced wet etch environments to vertically and laterally etch the release layer to separate the device structure from the substrate.
    Type: Application
    Filed: July 24, 2018
    Publication date: March 21, 2019
    Inventors: Christopher Youtsey, Robert McCarthy
  • Patent number: 10214295
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: February 26, 2019
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20180294372
    Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
    Type: Application
    Filed: April 6, 2018
    Publication date: October 11, 2018
    Inventors: Christopher Youtsey, Rekha Reddy, Christopher Stender
  • Publication number: 20170305564
    Abstract: Some embodiments include a high efficiency, lightweight solar sheet. Some embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached. Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: May 8, 2017
    Publication date: October 26, 2017
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9650148
    Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 16, 2017
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Publication number: 20170015430
    Abstract: Some embodiments include a kit for supplying solar power in a battery-powered or fuel cell powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells into a component of a UAV, affixing flexible solar cells to a surface of a UAV, or affixing flexible solar cells to a surface of a component of a UAV. The kit also includes a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV. Another embodiments include a solar sheet configured for installation on a surface of a UAV or on a surface of a component of a UAV. The solar sheet includes a plurality of solar cells and a polymer layer to which the plurality of solar cells are attached.
    Type: Application
    Filed: April 18, 2016
    Publication date: January 19, 2017
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 9356162
    Abstract: The present application utilizes an oxidation process to fabricating a Group III-V compound semiconductor solar cell device. By the oxidation process, a window layer disposed on a cell unit is oxidized to enhance the efficiency of the solar cell device. The oxidized window has an increased band gap to minimize the surface recombination of electrons and holes. The oxidized window also improves transparency at the wavelengths that were absorbed in the conventional window layer.
    Type: Grant
    Filed: January 28, 2010
    Date of Patent: May 31, 2016
    Assignee: MicroLink Devices, Inc.
    Inventors: Noren Pan, Christopher Youtsey, David S. McCallum, Victor C. Elarde, John M. Dallesasse
  • Patent number: 9315267
    Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: April 19, 2016
    Assignee: MICROLINK DEVICES, INC.
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 8993873
    Abstract: A solar cell structure is provided for reducing shadow losses without increasing series resistance in the solar cell device. The solar cell device may form an electrical contact to a solar cell emitter layer from the backside of the solar cell device. With this structure, the emitter contact shadow losses may be reduced significantly while simultaneously decreasing device series resistance.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: March 31, 2015
    Assignee: MicroLink Devices, Inc.
    Inventors: Christopher Youtsey, Francis Tuminello, Victor C. Elarde
  • Publication number: 20130285440
    Abstract: Some embodiments include a kit for increasing endurance of a battery-powered unmanned aerial vehicle (UAV) by incorporating flexible solar cells or applying flexible solar cells on a surface of a UAV or on a surface of a component of a UAV. The kit further include a power conditioning system configured to operate the solar cells within a desired power range and configured to provide power having a voltage compatible with an electrical system of the UAV.
    Type: Application
    Filed: February 15, 2013
    Publication date: October 31, 2013
    Inventors: Noren Pan, Raymond Chan, Haruki Miyamoto, Andree Wibowo, Mark Osowski, Christopher Youtsey, David McCallum
  • Patent number: 8440492
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: May 14, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Patent number: 8426237
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: October 11, 2012
    Date of Patent: April 23, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Patent number: 8361827
    Abstract: An assembly technique for assembling solar cell arrays is provided. During the fabrication of a solar cell, openings through the semiconductor layer are etched through to a top surface of the backmetal layer. The solar cells include an exposed top surface of the backmetal layer. A plurality of solar cells are assembled into a solar cell array where adjacent cells are interconnected in an electrically serial or parallel fashion solely from the top surface of the solar cells.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: January 29, 2013
    Assignee: MicroLink Devices, Inc.
    Inventors: Raymond Chan, Christopher Youtsey
  • Publication number: 20120227798
    Abstract: The present application utilizes an oxidation process to fabricating a Group III-V compound semiconductor solar cell device. By the oxidation process, a window layer disposed on a cell unit is oxidized to enhance the efficiency of the solar cell device. The oxidized window has an increased band gap to minimize the surface recombination of electrons and holes. The oxidized window also improves transparency at the wavelengths that were absorbed in the conventional window layer.
    Type: Application
    Filed: May 29, 2012
    Publication date: September 13, 2012
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Christopher YOUTSEY, David S. MCCALLUM, Victor C. ELARDE, John M. DALLESASSE
  • Publication number: 20110318866
    Abstract: The present invention utilizes epitaxial lift-off in which a sacrificial layer is included in the epitaxial growth between the substrate and a thin film III-V compound solar cell. To provide support for the thin film III-V compound solar cell in absence of the substrate, a backing layer is applied to a surface of the thin film compound solar cell before it is separated from the substrate. To separate the thin film compound solar cell from the substrate, the sacrificial layer is removed as part of the epitaxial lift-off. Once the substrate is separated from the thin film III-V compound solar cell, the substrate may then be reused in the formation of another thin film compound solar cell.
    Type: Application
    Filed: June 21, 2011
    Publication date: December 29, 2011
    Applicant: MICROLINK DEVICES, INC.
    Inventors: Noren PAN, Glen HILLIER, Duy Phach VU, Rao TATAVARTI, Christopher YOUTSEY, David MCCALLUM, Genevieve MARTIN