Abstract: A photoacoustic photon meter includes: a photoacoustic generative array including carbon nanotubes disposed in a photoacoustic generating pattern, such that the carbon nanotubes: receive photons comprising optical energy, and produce thermal energy from the optical energy; and a superstratum including a thermally expandable elastomer on which the photoacoustic generative array is fixedly disposed in position on the superstratum to spatially conserve the photoacoustic generating pattern, and such that the superstratum: is optically transparent to the photons; receives the thermal energy from the photoacoustic generative array; expands and contracts in response to receipt of the thermal energy; and produces photoacoustic pressure waves in response to the expansion and contraction, the photoacoustic pressure waves including a photoacoustic intensity and photoacoustic frequency that are based upon an amount of optical pressure applied to the carbon nanotubes by the photons, a spatial photon fluence of the photons

Abstract: A photoacoustic photon meter includes: a photoacoustic generative array including carbon nanotubes disposed in a photoacoustic generating pattern, such that the carbon nanotubes: receive photons comprising optical energy, and produce thermal energy from the optical energy; and a superstratum including a thermally expandable elastomer on which the photoacoustic generative array is fixedly disposed in position on the superstratum to spatially conserve the photoacoustic generating pattern, and such that the superstratum: is optically transparent to the photons; receives the thermal energy from the photoacoustic generative array; expands and contracts in response to receipt of the thermal energy; and produces photoacoustic pressure waves in response to the expansion and contraction, the photoacoustic pressure waves including a photoacoustic intensity and photoacoustic frequency that are based upon an amount of optical pressure applied to the carbon nanotubes by the photons, a spatial photon fluence of the photons

Abstract: A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used.

Abstract: A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used.

Abstract: A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used.

Abstract: A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used.

Abstract: This invention enables high temperature superconducting (HTS) metal oxide materials ReBa2Cu3Ox ((RE)BCO) to carry high superconducting currents at high current densities under high magnetic field (?3 Tesla), in all orientations of the field, and at high temperatures (65 Kelvin). The superconductor is adapted to carry current in a superconducting state, with the superconductor having a current (I) carrying capacity of at least 250 A/cm width, in a field of 3 Tesla (T), at 65 Kelvin (K), at all angles relative to the coated conductor. More preferably, the current carrying capacity extends through the range of substantially 250 A/cm to 500 A/cm. Excellent performance is achieved by use of intrinsic pinning centers in the HTS compound. The invention preferably does not require the addition of extra elements or compounds or particles to the superconducting compound during synthesis, nor does it require extra process steps.

Abstract: A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111>oriented textured layer, and a non-single crystal substrate, and methods for making the same. The textured layer has a crystalline alignment preferably formed by the ion-beam assisted deposition (IBAD) texturing process and can be biaxially aligned. The in-plane crystalline texture of the textured layer is sufficiently low to allow growth of high quality hexagonal material, but can still be significantly greater than the required in-plane crystalline texture of the hexagonal material. The IBAD process enables low-cost, large-area, flexible metal foil substrates to be used as potential alternatives to single-crystal sapphire and silicon for manufacture of electronic devices, enabling scaled-up roll-to-roll, sheet-to-sheet, or similar fabrication processes to be used.