Patents by Inventor Christy A. Hagerty

Christy A. Hagerty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE
    Publication number: 20140206153
    Abstract: A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.
    Type: Application
    Filed: March 25, 2014
    Publication date: July 24, 2014
    Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
    Inventors: Thomas J. McIntyre, Keith K. Sturcken, Christy A. Hagerty
  • Method for fabricating solder columns for a column grid array package
    Patent number: 8723323
    Abstract: A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.
    Type: Grant
    Filed: July 12, 2012
    Date of Patent: May 13, 2014
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Thomas J. McIntyre, Keith K. Sturcken, Christy A. Hagerty
  • METHOD FOR FABRICATING SOLDER COLUMNS FOR A COLUMN GRID ARRAY PACKAGE
    Publication number: 20140015098
    Abstract: A method for fabricating an electronic device package having a column grid array is disclosed. A column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.
    Type: Application
    Filed: July 12, 2012
    Publication date: January 16, 2014
    Applicant: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.
    Inventors: THOMAS J. McINTYRE, KEITH K. STURCKEN, CHRISTY A. HAGERTY
  • ISOSTRESS GRID ARRAY AND METHOD OF FABRICATION THEREOF
    Publication number: 20130309815
    Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.
    Type: Application
    Filed: July 26, 2013
    Publication date: November 21, 2013
    Applicant: BAE Systems Information and Electronic Systems Intergration Inc.
    Inventors: John A. Hughes, Christy A. Hagerty, Santos Nazario-Camacho, Keith K. Sturcken
  • Isostress grid array and method of fabrication thereof
    Patent number: 8586417
    Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: November 19, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Christy A. Hagerty, Santos Nazario-Camacho, Keith K. Sturcken
  • Isostress grid array and method of fabrication thereof
    Patent number: 8519527
    Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.
    Type: Grant
    Filed: September 29, 2010
    Date of Patent: August 27, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Christy A. Hagerty, Santos Nazario-Camacho, Keith K. Sturcken
  • Isostress grid array and method of fabrication thereof
    Publication number: 20110074009
    Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.
    Type: Application
    Filed: September 29, 2010
    Publication date: March 31, 2011
    Applicant: BAE Systems Information & Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Christy A. Hagerty, Santos Nazario-Camacho, Keith K. Sturcken