Patents by Inventor Chu-Cheng Wu

Chu-Cheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11431135
    Abstract: An electrical connector structure includes an insulating housing, a first terminal set, a second terminal set, a third terminal set and at least one conductive member. The first, second and third terminal sets are disposed in the insulating housing. Each of the first and second terminal sets includes a plurality of signal terminals and at least one ground terminal. The conductive member is electrically connected to the ground terminals of the first and second terminal sets, and is not electrically connected to the third terminal set.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: August 30, 2022
    Assignee: SPEED TECH CORP.
    Inventors: Chu-Cheng Wu, I-Ting Hsieh, Cheng-Hsiang Hsueh, Kuo-Hua Huang, Hua-Chun Chang
  • Publication number: 20210135405
    Abstract: An electrical connector structure includes an insulating housing, a first terminal set, a second terminal set, a third terminal set and at least one conductive member. The first, second and third terminal sets are disposed in the insulating housing. Each of the first and second terminal sets includes a plurality of signal terminals and at least one ground terminal. The conductive member is electrically connected to the ground terminals of the first and second terminal sets, and is not electrically connected to the third terminal set.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Applicant: SPEED TECH CORP.
    Inventors: Chu-Cheng WU, I-Ting HSIEH, Cheng-Hsiang HSUEH, Kuo-Hua HUANG, Hua-Chun CHANG
  • Publication number: 20190148887
    Abstract: An electrical connector includes a first terminal group, an insulation body, a conductive glue, and an insulation casing. The first terminal group includes grounding terminals and signal terminals. Each of the terminals in the first terminal group has a main portion. The insulation body is fixed to the main portion of each terminal of the first terminal group. The insulation body has openings exposing corresponding grounding terminals. The conductive glue fills the openings of the insulation body, and the conductive glue electrically connects the grounding terminals. The insulation casing includes a first side wall which includes first terminal slots. The first terminal group is disposed in the first terminal slots of the first side wall, and the conductive glue is sandwiched between the first side wall and the insulation body.
    Type: Application
    Filed: July 15, 2018
    Publication date: May 16, 2019
    Inventors: Li-Sen CHEN, Chu-Cheng WU
  • Patent number: 10283910
    Abstract: An electrical connector includes a first terminal group, an insulation body, a conductive glue, and an insulation casing. The first terminal group includes grounding terminals and signal terminals. Each of the terminals in the first terminal group has a main portion. The insulation body is fixed to the main portion of each terminal of the first terminal group. The insulation body has openings exposing corresponding grounding terminals. The conductive glue fills the openings of the insulation body, and the conductive glue electrically connects the grounding terminals. The insulation casing includes a first side wall which includes first terminal slots. The first terminal group is disposed in the first terminal slots of the first side wall, and the conductive glue is sandwiched between the first side wall and the insulation body.
    Type: Grant
    Filed: July 15, 2018
    Date of Patent: May 7, 2019
    Assignee: SPEED TECH CORP.
    Inventors: Li-Sen Chen, Chu-Cheng Wu
  • Patent number: 9627818
    Abstract: An electrical connector is fixed to a circuit board, and includes an inner insulating body and terminal modules. The inner insulating body includes a docking portion and a mounting portion. Each module has a carrier and terminals. The carrier is disposed on the mounting portion. The contacts are formed from a metal film and fixed to the carrier. Each terminal has a mating portion, a tail portion and a base portion connected between the mating portion and the tail portion. The mating portion extends from outside the carrier to inside the mating hole. The tail portion extends from outside the carrier to a surface of the circuit board. Each tail portion of a portion of the terminals has a soldering surface attached to the surface of the circuit board and a soldering pin passing through the surface of the circuit board respectively.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: April 18, 2017
    Assignee: SPEED TECH CORP.
    Inventors: Li-Sen Chen, Cheng-Hsiang Hsueh, Chu-Cheng Wu