Patents by Inventor Chu-Chung Stephen Lee

Chu-Chung Stephen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally enhanced molded package for semiconductors
    Publication number: 20060087015
    Abstract: Integrated circuit packaging with improved thermal transmission from the integrated circuit heat source to the exterior of the packaging. Improved packaging employs a compressive interposer which allows for greater manufacturability of the packaged integrated circuit parts. Additionally different shaped compressive interposers are described.
    Type: Application
    Filed: October 27, 2004
    Publication date: April 27, 2006
    Inventors: Yuan Yuan, Bennett Joiner, Chu-Chung (Stephen) Lee
  • Lead frame design for reduced wire sweep having a defined gap between tie bars and lead pins
    Patent number: 6225685
    Abstract: Wire sweep/crossing during resin molding is significantly reduced or prevented by reducing the gap spacing between corner lead pins and the tie bars of a die-attach pad. Embodiments of the present invention include spacing the tie bars from the corner lead pins by a distance no greater than about 18 mils, e.g., about 4 to 12 mils. Embodiments of the present invention also comprise a lead frame wherein the inner ends of the lead pins are arranged in a substantially planar array to define a substantially circular region surrounding the die-attach pad.
    Type: Grant
    Filed: April 5, 2000
    Date of Patent: May 1, 2001
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Robert Newman, Chu-Chung Stephen Lee, Melissa Siow-Lui Lee