Patents by Inventor Chu-Huei Huang

Chu-Huei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package on package structure and fabrication method thereof
    Patent number: 9905546
    Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: February 27, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Huei Huang
  • PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
    Publication number: 20150187741
    Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
    Type: Application
    Filed: March 14, 2014
    Publication date: July 2, 2015
    Applicant: Siliconware Precision Industries Co., Ltd
    Inventors: Shih-Hao Tung, Chang-Yi Lan, Lung-Yuan Wang, Cheng-Chia Chiang, Chu-Huei Huang