Patents by Inventor Chu-Hung Lin

Chu-Hung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178120
    Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.
    Type: Application
    Filed: February 8, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Ming Weng, Tzu-Sung Huang, Wei-Kang Hsieh, Hao-Yi Tsai, Ming-Hung Tseng, Tsung-Hsien Chiang, Yen-Liang Lin, Chu-Chun Chueh
  • Patent number: 11935969
    Abstract: A photodetector includes a first semiconductor layer, an absorption structure, a second semiconductor layer, and a barrier structure. The absorption structure is located on the first semiconductor layer, and having a first conduction band, a first valence band, and a first band gap. The second semiconductor layer is located on the absorption structure, and having a second conduction band, a second valence band, and a second band gap. The barrier structure is located between the absorption structure and the second semiconductor layer, and having a third conduction band, a third valence band, and a third band gap. The third conduction band is greater than the second conduction band or the third valence band is less than the second valence band.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-Chang Lee, Shiuan-Leh Lin, I-Hung Chen, Chu-Jih Su, Chao-Shun Huang
  • Patent number: 5933368
    Abstract: An architecture for a mass storage system using flash memory is described. This architecture involves organizing the flash memory into a plurality of blocks. These blocks are then divided into several categories. One of the categories is a working category used to store data organized in accordance with a pre-defined addressing scheme (such as the logical block address used in Microsoft's operating system). The other category is a temporary buffer used to store data intended to be written to one of the working blocks. Another category contains blocks that need to be erased. When data is written into the mass storage system, a block in the second category is allocated from a block in the third category. The allocated block will then be changed to a block in the first category when writing to the allocated block is completed. The correspond block in the first category is placed into the third category. As a result, blocks can be recycled.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: August 3, 1999
    Assignee: Macronix International Co., Ltd.
    Inventors: Chung-Wen Ma, Chu-Hung Lin, Tai-Yao Lee, Li-Jen Lee, Ju-Xu Lee, Ting-Chung Hu