Abstract: A magnetic component includes a first core component, a second core component and at least one coil. The first core component includes a first molding bobbin covering a first part of a core set by an injection molding process. The second core component includes a second molding bobbin covering a second part of the core set by the injection molding process. The first core component is assembled with the second core component to form a first pillar and a second pillar. Each of the first pillar and the second pillar includes a plurality of cores stacked with each other in a direction toward an outside or inside of the magnetic component. The at least one coil is wound on at least one of the first pillar and the second pillar.

Abstract: A wire-wound magnetic component includes a magnetic core, a coil set, a bobbin, an insulating wrapper, a caulking member and an ingress-protective finishing film. The magnetic core has at least one leg. The coil set is aligned and interacts with the magnetic core for electromagnetic induction, wherein the coil set includes at least one coil. The bobbin includes: a main body having a hollow portion for accommodating the leg of the magnetic core, and winding therearound a conductive wire to form the coil set, wherein the conductive wire has an unwound free end extending from the coil set; a cover plate disposed at an end of the main body and configured as a flange so as to define a winding space for accommodating the coil set; and an ingress-protective structure disposed in the winding space and separating the coil set from the cover plate.

Abstract: A wire-wound magnetic component includes a magnetic core, a coil set, a bobbin, an insulating wrapper, a caulking member and an ingress-protective finishing film. The magnetic core has at least one leg. The coil set is aligned and interacts with the magnetic core for electromagnetic induction, wherein the coil set includes at least one coil. The bobbin includes: a main body having a hollow portion for accommodating the leg of the magnetic core, and winding therearound a conductive wire to form the coil set, wherein the conductive wire has an unwound free end extending from the coil set; a cover plate disposed at an end of the main body and configured as a flange so as to define a winding space for accommodating the coil set; and an ingress-protective structure disposed in the winding space and separating the coil set from the cover plate.

Abstract: A transformer comprises a first core, a second core, a plurality of electrodes, an inner winding and an outer winding. The first core has a central hole. The second core is disposed in the central hole. The second core has two flanges and a pillar located between the two flanges. The inner winding is wound around the pillar. A first winding end of the inner winding is electrically connected to one of the electrodes. The inner winding comprises a first wire and a first insulating layer covering the first wire. The outer winding is wound around the inner winding. A second winding end of the outer winding is electrically connected to one of the electrodes. The outer winding comprises a second wire and a second insulating layer covering the second wire. Second thickness of the second insulating layer is larger than first thickness of the first insulating layer.

Abstract: A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor. The pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor. A second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor.

Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

Abstract: A transformer comprises a first core, a second core, a plurality of electrodes, an inner winding and an outer winding. The first core has a central hole. The second core is disposed in the central hole. The second core has two flanges and a pillar located between the two flanges. The inner winding is wound around the pillar. A first winding end of the inner winding is electrically connected to one of the electrodes. The inner winding comprises a first wire and a first insulating layer covering the first wire. The outer winding is wound around the inner winding. A second winding end of the outer winding is electrically connected to one of the electrodes. The outer winding comprises a second wire and a second insulating layer covering the second wire. Second thickness of the second insulating layer is larger than first thickness of the first insulating layer.

Abstract: A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor. The pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor. A second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor.

Abstract: A multi-layer wiring structure includes a first conductive structure, a second conductive structure and an insulating layer. To manufacturing the multi-layer wiring structure, a first conductive structure and a second conductive structure are provided. The first conductive structure and the second conductive structure include a plurality of wiring patterns. Then, the insulating layer is disposed between the first conductive structure and the second conductive structure. The insulting layer is thinner than the first conductive structure or the second conductive structure. The first conductive structure, the insulating layer and the second conductive structure are laminated to form the multi-layer wiring structure. A planar magnetic element having a compact coil manufactured by the method is also provided.

Abstract: A magnetic component includes a first core, a supporting base, at least one winding, at least one insulation member and a second core. The first core has an accommodating space. The supporting base is disposed in the accommodating space and the supporting base has an electrode platform. The at least one winding is disposed in the accommodating space and stacked on the supporting base, wherein a winding end of the at least one winding is disposed on a connecting portion of the electrode platform. The at least one insulation member is disposed in the accommodating space and stacked on the at least one winding. The second core is disposed on the first core and covers the accommodating space.

Abstract: An LED lamp includes a heat sink, a lamp shell and a light module. The heat sink includes a substrate and a plurality of fins. The substrate has a top surface and a bottom surface. The lamp shell is fixed to a periphery of the substrate. The light module is received between the lamp shell and the bottom surface of the substrate of the heat sink. The substrate defines a first through-hole through the top and bottom surfaces thereof to communicate airflow channels between the fins with a space below the bottom surface of the substrate, wherein the light module is received in the space.

Abstract: An LED luminous device comprises a fin assembly, heat pipes, a printed circuit board located on the fin assembly and LEDs arranged on the printed circuit board. The fin assembly defines elongated through holes therein. Each heat pipe comprises a first pipe and a plurality of second pipes communicated with the first pipe. The first pipe comprises a straight pipe and two extending pipes extending from two ends of the straight pipe, and the plurality of second pipes are located between the two extending pipes and parallel to the extending pipes. The plurality of second pipes is communicated with the straight pipe. The extending pipes and the second pipes are inserted into the elongated through holes of the fin assembly.

Abstract: An LED lamp includes a heat sink. The heat sink includes a base, a number of fins and two fixing elements for fixing the heat sink. The base includes a first face and a second face opposite to the first face. The fins extend from the first face of the base. The two fixing elements are detachably fixed on two ends of the base, respectively. Each fixing element includes a mounting plate, a fixing plate fixed on the first face of the base, and a connecting member connecting the fixing plate with the mounting plate.

Abstract: An exemplary lamp cover for covering a light source includes a connecting member, mounting members, first covering members, and a second covering member. The mounting members are integrally formed with the connecting member as a single piece. The first covering members are detachably mounted on the connecting member and alternated with the mounting members. The second covering member is capable of being mounted on the connecting member to replace one of the first covering members to change a shape of a light field of light emitted from the light source and through the lamp cover.

Abstract: An exemplary lamp cover for covering a light source includes a connecting member, mounting members, first covering members, and a second covering member. The mounting members are integrally formed with the connecting member as a single piece. The first covering members are detachably mounted on the connecting member and alternated with the mounting members. The second covering member is capable of being mounted on the connecting member to replace one of the first covering members to change a shape of a light field of light emitted from the light source and through the lamp cover.

Abstract: An LED lamp includes a heat sink and a plurality of LEDs. The heat sink includes a base and a plurality of fins. The base includes a first face and a second face opposite to the first face. The fins extend from the first face of the base. Each fin includes two streamline fin branches and a convex portion connecting the two fin branches. Each fin branch has a first end near a middle of the base, and a second end near an outer edge of the base. Each fin branch has a height gradually decreasing from the first end to the second end. The LEDs are attached to the second face of the base, and located corresponding to the convex portions, respectively.

Abstract: An LED lamp includes a heat sink, a lamp shell and a light module. The heat sink includes a substrate and a plurality of fins. The substrate has a top surface and a bottom surface. The lamp shell is fixed to a periphery of the substrate. The light module is received between the lamp shell and the bottom surface of the substrate of the heat sink. The substrate defines a first through-hole through the top and bottom surfaces thereof to communicate airflow channels between the fins with a space below the bottom surface of the substrate, wherein the light module is received in the space.