Abstract: The fabrication an NMOS device featuring a shallow source/drain region, performed as part of an integrated process sequence employed to integrate the fabrication of other type devices with the fabrication of the NMOS device, has been developed. A critical feature of the integrated process sequence is the formation of the shallow source/drain region of the NMOS accomplished after formation of the other type devices, thus reducing the risk of exposure of the shallow source/drain region to possible damaging procedures used for the other type devices. In addition the process used to remove a photoresist shape, used to protect the completed other type devices from the shallow source/drain ion implantation procedure, has been modified again to reduce possible damage to the shallow source/drain region.

Abstract: The fabrication an NMOS device featuring a shallow source/drain region, performed as part of an integrated process sequence employed to integrate the fabrication of other type devices with the fabrication of the NMOS device, has been developed. A critical feature of the integrated process sequence is the formation of the shallow source/drain region of the NMOS accomplished after formation of the other type devices, thus reducing the risk of exposure of the shallow source/drain region to possible damaging procedures used for the other type devices. In addition the process used to remove a photoresist shape, used to protect the completed other type devices from the shallow source/drain ion implantation procedure, has been modified again to reduce possible damage to the shallow source/drain region.

Abstract: A method of making a microelectronic device providing a base substrate having a bond pad, a first passivation layer overlying the base substrate and a portion of the bond pad, and a second passivation layer overlying the first passivation layer; forming a first sacrificial layer over the second passivation layer, wherein the first sacrificial layer includes an opening therethrough; etching the exposed portion of the second passivation layer to provide a recess therein; trimming a portion of the first sacrificial layer to enlarge the opening; etching the exposed portion of the second passivation layer to provide an enlarged recess and a first riser, a second tread, a second riser and a second tread; removing the first sacrificial layer; depositing a redistribution layer into the enlarged recess in the second passivation layer and over the first riser, first tread, second riser, and second tread.