Patents by Inventor Chu-Wen Wang

Chu-Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power grid layout designs for integrated circuits
    Patent number: 11189569
    Abstract: Integrated circuit layouts are disclosed that include metal layers with metal tracks having separate metal sections along the metal tracks. The separate metal sections along a single track may be electrically isolated from each other. The separate metal sections may then be electrically connected to different voltage tracks in metal layers above and/or below the metal layer with the separate metal sections. One or more of the metal layers in the integrated circuit layouts may also include metal tracks at different voltages (e.g., power and ground) that are adjacent to each other within a power grid layout. The metal tracks may be separated by electrically insulating material. The metal tracks and the electrically insulating material between the tracks may create capacitance in the power grid layout.
    Type: Grant
    Filed: September 23, 2016
    Date of Patent: November 30, 2021
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Richard T. Schultz, Regina Tien Schmidt, Derek P. Peterson, Te-Hsuan Chen, Elizabeth C. Conrad, Catherina Simona Matheis Ionescu, Chu-Wen Wang
  • POWER GRID LAYOUT DESIGNS FOR INTEGRATED CIRCUITS
    Publication number: 20180090440
    Abstract: Integrated circuit layouts are disclosed that include metal layers with metal tracks having separate metal sections along the metal tracks. The separate metal sections along a single track may be electrically isolated from each other. The separate metal sections may then be electrically connected to different voltage tracks in metal layers above and/or below the metal layer with the separate metal sections. One or more of the metal layers in the integrated circuit layouts may also include metal tracks at different voltages (e.g., power and ground) that are adjacent to each other within a power grid layout. The metal tracks may be separated by electrically insulating material. The metal tracks and the electrically insulating material between the tracks may create capacitance in the power grid layout.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 29, 2018
    Inventors: Richard T. Schultz, Regina Tien Schmidt, Derek P. Peterson, Te-Hsuan Chen, Elizabeth C. Conrad, Catherina Simona Matheis Ionescu, Chu-Wen Wang