Patents by Inventor Chu-Yi Chiu

Chu-Yi Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power receptacle, power plug and power connector assembly with improved heat dissipation path
    Patent number: 8303331
    Abstract: A power connector assembly includes mateable power receptacle and power plug. The power receptacle includes a first insulative housing defining a first heat dissipation path extending through opposite first mating and mounting surfaces, and a receptacle power contact exposed to the first heat dissipation path. The power plug includes a second insulative housing defining a second heat dissipation path extending through a second mounting surface of the second insulative housing, and a plug power contact for abutting against the receptacle power contact. The first and the second heat dissipation paths are in communication with each other and are exposed to an exterior so that heat generated by the receptacle power contact and the plug power contact can be dissipated therethrough.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: November 6, 2012
    Assignee: Alltop Electronics (Suzhou) Co., Ltd
    Inventors: Wang-I Yu, Chu-Yi Chiu, Hung-Chi Tai
  • POWER RECEPTACLE, POWER PLUG AND POWER CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION PATH
    Publication number: 20110287658
    Abstract: A power connector assembly includes mateable power receptacle and power plug. The power receptacle includes a first insulative housing defining a first heat dissipation path extending through opposite first mating and mounting surfaces, and a receptacle power contact exposed to the first heat dissipation path. The power plug includes a second insulative housing defining a second heat dissipation path extending through a second mounting surface of the second insulative housing, and a plug power contact for abutting against the receptacle power contact. The first and the second heat dissipation paths are in communication with each other and are exposed to an exterior so that heat generated by the receptacle power contact and the plug power contact can be dissipated therethrough.
    Type: Application
    Filed: October 26, 2010
    Publication date: November 24, 2011
    Applicant: ALLTOP ELECTRONICS (SUZHOU) CO., LTD.
    Inventors: Wang-I YU, Chu-Yi CHIU, Hung-Chi TAI