Abstract: A system and method for user access time based content filtering for Internet materials. A user access time distribution pattern of one or more known offensive Internet files may be compiled and stored as a model. The user access time distribution pattern of a target Internet file may be calculated and compared with the model. If the user access time distribution pattern of the target Internet file is sufficiently similar to the model, the target Internet file may be identified as offensive, and may be so labeled.

Abstract: A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.

Abstract: To address the requirements described above, a method, apparatus, article of manufacture, and a memory structure for providing advertisements with a media program transmitted to a user computer. The method permits the user to provide survey responses in exchange for viewing a media program with fewer advertisement, and permits the user to manage the survey responses.

Abstract: A signal transmission assembly includes first and second substrates respectively having first and second electrodes, and a conductive layer disposed between the electrodes. The second electrode has a trench. The conductive layer includes an adhesive and conductive particles distributed therein. The second electrode is electrically connected to the first electrode through the conductive layer, and a portion of the adhesive is filled into the trench. When the assembly is applied to a display device, the first electrode electrically connects a non-display area to a display area of a display panel. When the second electrode and a third electrode at two ends of the second substrate are electrically connected to the first electrode and a third substrate (e.g., a PCB), respectively, a signal may be transmitted from the third substrate to the display area through the second substrate, the second electrode and the first electrode to control the display.

Abstract: A structure for circuit assembly is applied to positional alignment in bonding process. The structure for circuit assembly comprises a first substrate, having a plurality of first terminals and both a first alignment mark and a second alignment mark located in the vicinity of the first terminals, and a second substrate, having a plurality of second terminals and a transmissive area located in the vicinity of second terminals. During the first substrate bonding with the second substrate, as the edge of the transmissive area is located between the first alignment mark and the second alignment mark, and the first alignment mark is outside of the transmissive area, the first terminals are normally connected with the second terminals.

Abstract: Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.

Abstract: A faucet channel structure and manufacturing method is applied to a faucet having a channel including a curved section, and comprises a faucet body and a channel lid. The faucet body includes an open channel having a polished surface. The channel lid includes a polished surface corresponding to the polished surface of the open channel of the faucet body.

Abstract: A protective device for a control rod of a water faucet control is incorporated with an outlet control. The outlet control is mounted underneath a water outlet and comprises a control rod. The control rod comprises a protective device made of soft material. The protective device is provided with a fastening member to connect the protective device to the control rod. The protective device provides a user a soft touching feeling and may be exchanged or cleaning at a convenient manner.

Abstract: A water faucet includes a main body. The main body comprises a water outlet and a water control. An outer cover is mounted close to either the water outlet or the water control. The outer cover comprises a rib to protect the water control from being dismantled. Both the main body and the outer cover comprise fasteners corresponding to each other. The outer cover may be replaceable at any time. The outer cover further comprises a circular through to accommodate a decorative strip therein or comprises a transparent chamber having water inlets and a water outlet to accommodate either colorful balls or reeds.

Abstract: Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.