Patents by Inventor Chu-An Chang

Chu-An Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142344
    Abstract: In example implementations described herein, there are systems and methods enabling manufacturers to become more efficient by providing a digital tool to track, visualize, quantify, and notify production bottlenecks for quick actions. Some implementations include an apparatus including a processor configured to analyze time-stamp data collected associated with a plurality of elements of an industrial process. The processor may be configured to generate, based on the analyzed time-stamp data, a color coded visualization of the industrial process, where generating the color coded visualization includes associating each of the plurality of elements of the industrial process with a corresponding color indicating a state of an element in the plurality of elements of the industrial process. The processor may further be configured to present, via a display, the generated color coded visualization of the industrial process.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Wei YUAN, Yi-chu CHANG, Lili ZHENG
  • Publication number: 20240116172
    Abstract: Aspects of the present disclosure involve systems and methods, which can include, for receipt of a pallet involving a plurality of objects, controlling a robotic arm to depalletize each of the plurality of objects from the pallet according to a position, orientation, and weight of the each of the plurality of objects retrieved from a database.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventor: Yi-chu CHANG
  • Patent number: 11953877
    Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: April 9, 2024
    Assignee: NILE, Inc.
    Inventors: Dragan Jurkovic, Patrick Conall Regan, Chih-Chi Chang, Chang-chu Liao, Ming-Feng Jean, Kuo-Hung Lee, Yen-Hsi Liu, Hung-Yu Wu
  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Patent number: 11935969
    Abstract: A photodetector includes a first semiconductor layer, an absorption structure, a second semiconductor layer, and a barrier structure. The absorption structure is located on the first semiconductor layer, and having a first conduction band, a first valence band, and a first band gap. The second semiconductor layer is located on the absorption structure, and having a second conduction band, a second valence band, and a second band gap. The barrier structure is located between the absorption structure and the second semiconductor layer, and having a third conduction band, a third valence band, and a third band gap. The third conduction band is greater than the second conduction band or the third valence band is less than the second valence band.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Shih-Chang Lee, Shiuan-Leh Lin, I-Hung Chen, Chu-Jih Su, Chao-Shun Huang
  • Patent number: 11935981
    Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: March 19, 2024
    Assignee: EPISTAR CORPORATION
    Inventors: Chu-Jih Su, Chia-Hsiang Chou, Wei-Chih Peng, Wen-Luh Liao, Chao-Shun Huang, Hsuan-Le Lin, Shih-Chang Lee, Mei Chun Liu, Chen Ou
  • Patent number: 11929327
    Abstract: The present disclosure describes a method for forming liner-free or barrier-free conductive structures. The method includes depositing an etch stop layer on a cobalt contact disposed on a substrate, depositing a dielectric on the etch stop layer, etching the dielectric and the etch stop layer to form an opening that exposes a top surface of the cobalt contact, and etching the exposed top surface of the cobalt contact to form a recess in the cobalt contact extending laterally under the etch stop layer. The method further includes depositing a ruthenium metal to substantially fill the recess and the opening, and annealing the ruthenium metal to form an oxide layer between the ruthenium metal and the dielectric.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Inc.
    Inventors: Hsu-Kai Chang, Keng-Chu Lin, Sung-Li Wang, Shuen-Shin Liang, Chia-Hung Chu
  • Publication number: 20240066660
    Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Haosheng Wu, Hari Soundararajan, Jianshe Tang, Shou-Sung Chang, Brian J. Brown, Yen-Chu Yang, You Wang, Rajeev Bajaj
  • Publication number: 20240060117
    Abstract: Energy transfer dye pairs including a donor dye covalently attached to an acceptor dye through a linker, uses of the energy transfer dye pairs, for example, in conjugates of an energy transfer dye pair covalently attached to a quencher and an analyte (e.g., an oligonucleotide), for biological applications including, for example, amplification assays such as quantitative polymerase chain reaction (qPCR) and digital PCR (dPCR).
    Type: Application
    Filed: July 23, 2021
    Publication date: February 22, 2024
    Inventors: Scott BENSON, Steven MENCHEN, Chu-An CHANG, Linda LEE, Khairuzzaman MULLAH
  • Publication number: 20230417257
    Abstract: An integrated ceiling fan and a ceiling fan connecting device are provided. The integrated ceiling fan includes the ceiling fan connecting device, a ceiling device, and a ceiling fan device. The ceiling fan connecting device includes a connecting housing and a connecting seat, and the connecting housing has a top surface, a surrounding side surface that surrounds and is connected to an edge of the top surface, and a plurality of mounting slots that are recessed from the top surface. The ceiling device includes a ceiling housing and a plurality of first fixing members that are locked to the ceiling housing and the top surface of the connecting housing. The ceiling fan device includes a motor housing, a plurality of second fixing members that are respectively located in the mounting slots and are locked to the motor housing, and a ceiling fan main body.
    Type: Application
    Filed: June 24, 2022
    Publication date: December 28, 2023
    Inventors: KAI-JEN TSAI, HSIN-CHU CHANG, CHIA-WEI CHANG, MIN-YUAN HSIAO
  • Patent number: 11856387
    Abstract: A video conferencing system is provided, which includes at least one camera device, a microphone array device, a sound output device, and a processor. The processor is configured to: receive multiple image signals converted by an image shot by the at least one camera device, and receive multiple voice signals converted from multiple voices captured from the microphone array device; and select at least one sound source signal corresponding to multiple personnel positions from the multiple sound signals according to the image signal and the multiple voice signals, so as to transmit at least one sound source signal corresponding to the multiple personnel positions to the sound output device, where the sound output device converts at least one sound source signal into sound for play. In addition, a video conferencing method is also disclosed herein.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: December 26, 2023
    Assignee: AVer Information Inc.
    Inventors: Ching-Yuan Pan, Fu-En Tsai, Chen-Chu Chang
  • Publication number: 20230413172
    Abstract: The present invention discloses a wireless communication apparatus having transmission strategy adjusting mechanism that includes a receiving circuit, a detection circuit, a statistics circuit, a strategy determining circuit and a transmission circuit. The receiving circuit receives communication behaviors of external apparatuses. The detection circuit detects inter frame spaces (IFS) corresponding to the communication behaviors and records related time lengths and a set of communication parameters. The statistics circuit performs statistics on the inter frame space according to a plurality of time intervals to generate Inter frame space statistics data. The strategy determining circuit analyzes at least one of the time lengths, communication parameters and Inter frame space statistics data according to at least one application requirement to generate a transmission parameter adjusting signal.
    Type: Application
    Filed: May 25, 2023
    Publication date: December 21, 2023
    Inventors: WEI-SHIN LI, CHUN-CHU CHANG
  • Publication number: 20230304932
    Abstract: A system (1000) comprising first and second excitation sources (101a, 101b) with respective excitation wavelengths for exciting first second and third dyes in a sample (110) and further comprising a detector (115), first and second emission spectral elements (121a, 121b) for transmitting respective first and second emission wavelengths as well as a processor (130) for automatically operating the elements of the system. The first dye comprises a first absorption spectrum comprising a first maximum absorption wavelength and the second dye comprises a second absorption spectrum comprising a second maximum absorption wavelength that is equal to or substantially equal to the first maximum absorption wavelength. The second dye comprises a second emission spectrum comprising a second maximum emission wavelength and the third dye comprises a third emission spectrum comprising a third maximum emission wavelength that is equal to or substantially equal to the second maximum emission wavelength.
    Type: Application
    Filed: July 23, 2021
    Publication date: September 28, 2023
    Inventors: Scott BENSON, Steven MENCHEN, Chu-An CHANG, Linda LEE, Jacob FREUDENTHAL, Khairuzzaman MULLAH
  • Publication number: 20230306300
    Abstract: An electronic device manufacturing system configured to obtain sensor data associated with a deposition process performed in a process chamber to deposit a film stack on a surface of a substrate. The film stack can include a known film pattern and an unknown film pattern. The manufacturing system is further configured to input the sensor data into a first trained machine-learning model to obtain a first output value of the first trained machine-learning model. The first output value can be associated with the known film pattern. The manufacturing system is further configured to input the first output value into a second trained machine-learning model to obtain a second output value of the second trained machine-learning model. The second output value can be indicative of metrology data of the known film pattern.
    Type: Application
    Filed: March 25, 2022
    Publication date: September 28, 2023
    Inventors: Ping-Yu Chou, Ya-Chu Chang, Jui-Che Lin, Hao-Wei Peng, Chao-Hsien Lee, Shauh-Teh Juang
  • Patent number: 11755003
    Abstract: Example implementations described herein involve systems and methods for operation of a robot configured to work on a first process and a second process, which can involve receiving sensor data indicative of a status of one or more of the first process and the second process; for the status indicative of the first process waiting on the robot, controlling the robot to work on the first process; and for the status indicative of the first process not waiting on the robot, controlling the robot to conduct one or more of work on the second process or return to standby.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: September 12, 2023
    Assignee: HITACHI, LTD.
    Inventors: Yi-Chu Chang, Heming Chen
  • Publication number: 20230268262
    Abstract: A method of manufacturing an electronic package is provided and includes disposing a circuit member and a plurality of electronic elements on opposite sides of a carrier structure having circuit layers respectively, so that any two of the plurality of electronic elements can be electrically connected to each other via the circuit layers and the circuit member, where a vertical projected area of the carrier structure is larger than a vertical projected area of the circuit member, such that the circuit member is free from being protruded from side surfaces of the carrier structure. Therefore, the circuit member replaces a part of circuit layers of the carrier structure to reduce the difficulty of fabricating the circuit layers in the carrier structure.
    Type: Application
    Filed: May 23, 2022
    Publication date: August 24, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Li-Chu Chang, Yuan-Hung Hsu, Don-Son Jiang
  • Publication number: 20230244204
    Abstract: Aspects of the present disclosure can involve systems and methods for a mobile device connected to a local area network (LAN) facilitating connections between a programmable logic controller (PLC) and one or more apparatuses, the mobile device involving a camera and a microphone, which can involve receiving input from one or more of the camera and the microphone; generating one or more of executable code for the PLC and configuration information for the one or more apparatuses from parsing of the input; and transmitting, over the LAN, the one or more of the executable code for the PLC and the configuration information for the one or more apparatuses to the PLC.
    Type: Application
    Filed: January 25, 2022
    Publication date: August 3, 2023
    Inventors: Yi-chu Chang, Lili Zheng
  • Publication number: 20230166294
    Abstract: An ultrasonic transducer includes a piezoceramic element with a first surface and a second surface opposite to each other through the piezoceramic element and a lateral surface connecting the first surface and the second surface, an acoustic matching layer with a third surface and a fourth surface opposite to each other through the acoustic matching layer and the third surface connecting with the second surface of the piezoceramic element, a first damping element with a fifth surface and a sixth surface opposite to each other through the first damping element and the sixth surface connecting with the first surface of the piezoceramic element, and a second damping element encapsulating the first damping element and the lateral surface of the piezoceramic element.
    Type: Application
    Filed: January 27, 2022
    Publication date: June 1, 2023
    Applicant: Unictron Technologies Corporation
    Inventors: Yi-Ting Su, Lung Chen, Wei-Jen Wu, Sheng-Yen Tseng, Ming-Chu Chang
  • Publication number: 20230124451
    Abstract: Disclosed is a probe for use in biological assays. The probe includes a fluorescent dye bound to a quencher compound through an oligonucleotide linker. Also disclosed are methods of using the probe, such as for a polymerase chain reaction (PCR), such as in a quantitative PCR reaction (qPCR), as well as kits including the probe.
    Type: Application
    Filed: December 7, 2022
    Publication date: April 20, 2023
    Inventors: Khairuzzaman Bashar MULLAH, Brian EVANS, Scott C. BENSON, Chu-An CHANG, Xiongwei YAN
  • Publication number: 20230103026
    Abstract: Example implementations described herein involve systems and methods for operation of a robot configured to work on a first process and a second process, which can involve receiving sensor data indicative of a status of one or more of the first process and the second process; for the status indicative of the first process waiting on the robot, controlling the robot to work on the first process; and for the status indicative of the first process not waiting on the robot, controlling the robot to conduct one or more of work on the second process or return to standby.
    Type: Application
    Filed: September 30, 2021
    Publication date: March 30, 2023
    Inventors: Yi-chu Chang, Heming Chen