Patents by Inventor Chuan Chieh (Dennis) Tseng

Chuan Chieh (Dennis) Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250145940
    Abstract: The present invention provides a transformed strain, comprising: a host cell; a first nucleotide sequence, located inside the host cell, the first nucleotide sequence encoding a PETase, which is derived from Ideonella; and a second nucleotide sequence, located inside the host cell, the second nucleotide sequence comprising a first chaperon nucleotide sequence or a second chaperon nucleotide sequence; wherein the first chaperon nucleotide sequence encodes a molecular chaperon protein (GroELS), and the second chaperon nucleotide sequence encodes a lipase secretion chaperone protein (LsC). The present invention also provides a method for degrading plastic, using said transformed strain for degrading a plastic having PET.
    Type: Application
    Filed: November 6, 2024
    Publication date: May 8, 2025
    Inventors: I-Son NG, Jie-Yao YU, Wan-Wen TING, Chuan-Chieh HSIANG
  • Publication number: 20250081381
    Abstract: A hybrid rail support system. The hybrid rail support system includes a wider width information handling system chassis; and, a hybrid rail support component extending from a front portion of the server rack to a rear portion of the server rack, the hybrid rail support component comprising: a static rail, the static rail being configured to mount to a side of a server rack; and, a sliding rail, the sliding rail being configured to move along the static rail from an inserted position to an extended position, the sliding rail being configured to mount to a rear portion of a wider width information handling system chassis, the sliding rail enabling the wider width information handling system chassis to extend from a rack to a rack service position.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Applicant: Dell Products L.P.
    Inventors: Chuan Chieh Tseng, Sam Shang, Christopher Sismilich, Kevin Garrett
  • Publication number: 20240240210
    Abstract: Provided is a recombinant microorganism including at least two genes for producing itaconic acid and its derived monomers, and the at least two genes are located on the same expression vector. The at least two genes include one encoding cis-aconitic acid decarboxylase and the other one encoding aconitase, and the genome of the recombinant microorganism includes a gene encoding the molecular chaperone protein GroELS. Also provided is a method for producing itaconic acid by using the microorganism.
    Type: Application
    Filed: March 23, 2023
    Publication date: July 18, 2024
    Inventors: I-Son NG, Jo-Shu CHANG, Chuan-Chieh HSIANG, Yeong-Chang CHEN, Yu-Chiao LIU, Chia-Wei TSAI
  • Publication number: 20240178268
    Abstract: A capacitor structure including a substrate, a capacitor, a second dielectric layer, a first conductive layer, and a second conductive layer is provided. The capacitor includes first electrode layers, at least one second electrode layer, and a first dielectric layer. The first electrode layers and the at least one second electrode layer are alternately disposed on the substrate. The first dielectric layer is disposed between the first electrode layer and the second electrode layer. The second dielectric layer has first openings and at least one second opening. The first openings expose the first electrode layers. The second opening exposes the second electrode layer. The first conductive layer is electrically connected to the first electrode layers. The first conductive layer is a single conductive layer disposed on the second dielectric layer and extending into the first openings. The second conductive layer is electrically connected to the second electrode layer.
    Type: Application
    Filed: January 12, 2023
    Publication date: May 30, 2024
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Wei-Yu Lin, Chuan-Chieh Lin
  • Publication number: 20240132923
    Abstract: Provided is a recombinant microorganism including at least two genes for producing itaconic acid and its derived monomers, and the at least two genes are located on the same expression vector. The at least two genes include one encoding cis-aconitic acid decarboxylase and the other one encoding aconitase, and the genome of the recombinant microorganism includes a gene encoding the molecular chaperone protein GroELS. Also provided is a method for producing itaconic acid by using the microorganism.
    Type: Application
    Filed: March 22, 2023
    Publication date: April 25, 2024
    Inventors: I-Son NG, Jo-Shu CHANG, Chuan-Chieh HSIANG, Yeong-Chang CHEN, Yu-Chiao LIU, Chia-Wei TSAI
  • Publication number: 20240084954
    Abstract: A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Chuan-Chieh Chiang, Chun-Jung Hsu
  • Patent number: 11852291
    Abstract: A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chuan-Chieh Chiang, Chun-Jung Hsu
  • Patent number: 11756989
    Abstract: A capacitor is made using a wafer, and includes structural elevation portions to allow an electrode layer in the capacitor to be extended along surface profiles of the structural elevation portions to thereby increase its extension length, so as to reduce capacitor area, simplify capacitor manufacturing process and reduce manufacturing cost.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: September 12, 2023
    Assignee: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
    Inventors: Wei-Yu Lin, Chuan-Chieh Lin, Shih-Hao Cheng
  • Patent number: 11756990
    Abstract: A capacitor structure including a substrate, a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, a third electrode, and a stress balance layer is provided. The substrate has trenches and a pillar portion located between two adjacent trenches. The first electrode is disposed on the substrate, on the pillar portion, and in the trenches. The first dielectric layer is disposed on the first electrode and in the trenches. The second electrode is disposed on the first dielectric layer and in the trenches. The second dielectric layer is disposed on the second electrode and in the trenches. The third electrode is disposed on the second dielectric layer and in the trenches. The third electrode has a groove, and the groove is located in the trench. The stress balance layer is disposed in the groove.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: September 12, 2023
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Wei-Yu Lin, Chuan-Chieh Lin
  • Publication number: 20230265961
    Abstract: A support platform is configured to support at least a portion of the weight of an associated semiconductor manufacturing tool, such as a furnace, when the associated semiconductor manufacturing tool is disposed on the support platform. The support platform comprises a base, a support plate disposed on the base and configured to move respective to the base, a brake plate arranged in fixed position respective to the base, and a damper secured to one of the support plate or the brake plate and frictionally engaging a track of the other of the support plate or the brake plate. The track includes a central track portion and inclined track portions extending away from the central track portion on respective first and opposite second sides of the central track portion. The inclined track portions are each inclined with respect to the central track portion.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 24, 2023
    Inventor: Chuan-Chieh Chiang
  • Publication number: 20230223427
    Abstract: A capacitor structure including a substrate, a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, a third electrode, and a stress balance layer is provided. The substrate has trenches and a pillar portion located between two adjacent trenches. The first electrode is disposed on the substrate, on the pillar portion, and in the trenches. The first dielectric layer is disposed on the first electrode and in the trenches. The second electrode is disposed on the first dielectric layer and in the trenches. The second dielectric layer is disposed on the second electrode and in the trenches. The third electrode is disposed on the second dielectric layer and in the trenches. The third electrode has a groove, and the groove is located in the trench. The stress balance layer is disposed in the groove.
    Type: Application
    Filed: January 25, 2022
    Publication date: July 13, 2023
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventors: Wei-Yu Lin, Chuan-Chieh Lin
  • Patent number: 11700706
    Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: July 11, 2023
    Assignee: Dell Products L.P.
    Inventors: Chuan Chieh Tseng, Ming-Hui Pan
  • Patent number: 11678460
    Abstract: An assembly that includes a planar surface, a plurality of first features disposed on the planar surface and a plurality of second features disposed on the planar surface. Each second feature is associated with one of the first features and a fan module coupled to one of the first features and the associated second feature.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: June 13, 2023
    Assignee: DELL PRODUCTS L.P.
    Inventors: Nelson Hsieh, Chuan Chieh Tseng
  • Publication number: 20220399436
    Abstract: A capacitor is made using a wafer, and includes structural elevation portions to allow an electrode layer in the capacitor to be extended along surface profiles of the structural elevation portions to thereby increase its extension length, so as to reduce capacitor area, simplify capacitor manufacturing process and reduce manufacturing cost.
    Type: Application
    Filed: August 22, 2022
    Publication date: December 15, 2022
    Inventors: WEI-YU LIN, CHUAN-CHIEH LIN, SHIH-HAO CHENG
  • Publication number: 20220117111
    Abstract: A riser of an information handling system having an adjustable baffle that blocks air flowing through the riser from by-passing components of an expansion card, such as a PCIe card, installed in the riser. The baffle directs the flowing air across components of the expansion card to lower the operating temperature of the expansion card by convection. In some embodiments, part of the baffle is coupled to an angled slot of the riser body and another part of the baffle is coupled to a card holder so that movement of the card holder automatically adjusts the position of the baffle to direct otherwise by-passing air toward the components of the installed expansion card.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Applicant: Dell Products L.P.
    Inventors: Chuan Chieh Tseng, Ming-Hui Pan
  • Patent number: 11182233
    Abstract: A method for recording memory errors includes the following steps: upon detecting a current correctable error that occurred in a volatile memory device, determining whether a count value corresponding to the current correctable error exceeds a predetermined value; and when it is determined that the count value corresponding to the current correctable error thus detected does not exceed the predetermined value, sending update event information corresponding to the current correctable error to a BMC, in order for the BMC to record information of the current correctable error.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: November 23, 2021
    Assignee: MITAC COMPUTING TECHNOLOGY CORPORATION
    Inventors: Rui-Guang Chen, Chuan-Chieh Wang
  • Publication number: 20210036098
    Abstract: A capacitor is made using a wafer, and includes structural elevation portions to allow an electrode layer in the capacitor to be extended along surface profiles of the structural elevation portions to thereby increase its extension length, so as to reduce capacitor area, simplify capacitor manufacturing process and reduce manufacturing cost.
    Type: Application
    Filed: January 13, 2020
    Publication date: February 4, 2021
    Inventors: WEI-YU LIN, CHUAN-CHIEH LIN, SHIH-HAO CHENG
  • Patent number: 10852786
    Abstract: A venting grate includes a main portion, a first venting area, and a second venting area. The first venting area is defined by first, second, third, and fourth edges. Each of the first, second, third, and fourth edges extend from the main portion. The second venting area is defined by fifth, sixth, seventh, and eighth edges. Each of the fifth, sixth, seventh, and eighth edges extend from the main portion. The third edge and the fifth edge extend away from the main portion of the venting grate and angle together to form a pointed edge between the first and second venting areas.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: December 1, 2020
    Assignee: Dell Products, L.P.
    Inventors: Chuck Lien, Yi-Hsin Kuan, Chuan Chieh (Dennis) Tseng, Chin-Chia Chang, Richard A. Crisp, Timothy C. Dearborn
  • Publication number: 20200341831
    Abstract: A method for recording memory errors includes the following steps: upon detecting a current correctable error that occurred in a volatile memory device, determining whether a count value corresponding to the current correctable error exceeds a predetermined value; and when it is determined that the count value corresponding to the current correctable error thus detected does not exceed the predetermined value, sending update event information corresponding to the current correctable error to a BMC, in order for the BMC to record information of the current correctable error.
    Type: Application
    Filed: April 16, 2020
    Publication date: October 29, 2020
    Inventors: Rui-Guang CHEN, Chuan-Chieh WANG
  • Publication number: 20200329581
    Abstract: An assembly comprising a planar surface, a plurality of first features disposed on the planar surface, a plurality of second features disposed on the planar surface, each second feature associated with one of the first features and a fan module coupled to one of the first features and the associated second feature.
    Type: Application
    Filed: April 10, 2019
    Publication date: October 15, 2020
    Applicant: DELL PRODUCTS L.P.
    Inventors: Nelson Hsieh, Chuan Chieh Tseng