Abstract: A projector includes a laser module for generating a laser beam and a wafer-level optics. The wafer-level optics includes a first substrate, a first collimator lens and a diffractive optical element, wherein the first collimator lens is manufactured on a first surface of the first substrate, and is arranged for receiving the laser beam from the laser module to generate a collimated laser beam; and the collimated laser beam directly passes through the diffractive optical element to generate a projected image of the projector.

Abstract: A projector includes a laser module for generating a laser beam and a wafer-level optics. The wafer-level optics includes a first substrate, a first collimator lens and a diffractive optical element, wherein the first collimator lens is manufactured on a first surface of the first substrate, and is arranged for receiving the laser beam from the laser module to generate a collimated laser beam; and the collimated laser beam directly passes through the diffractive optical element to generate a projected image of the projector.

Abstract: Structure and fabricating method of a wafer level substrate for carrying light emitting devices are provided in present invention. The wafer level silicon substrate structure includes a first substrate and a second substrate. A metal line is constructed on a surface of the first substrate according to a predetermined pattern. The predetermined pattern is divided into a plurality of first portions and a plurality of second portions. The second substrate is adhered to the surface of the first substrate. The second substrate has a plurality of through holes. Each of the through holes is respectively corresponding to the first portions. Each of the first portions is adapted to electrically connect with a light emitting device. The provided wafer level substrate structure configured with light emitting devices is capable of providing uniform light output, having better light extraction property, improving process yield, higher production yield and achieving product uniformity.

Abstract: An optical lens on wafer level consists of a first optical component, a first spacer, a second optical component, at least a first via plug, and an adhesion material. The first spacer includes at least a first via plug passing through the first spacer, wherein the first optical component and the second optical component are separated by the first spacer. The adhesion material is coated in between the first optical component and the first spacer and coated in between the first spacer and the second optical component, and is filled in at least a portion of the first via plug.

Abstract: A wafer level lens module includes a first optical layer, a spacer layer and a second optical layer. The spacer layer is disposed upon the first optical layer, having a hole through the spacer layer for light passage, wherein a surface of the hole substantially avoids light reflection. And the second optical layer is disposed upon the spacer layer.

Abstract: An optical lens on wafer level consists of a first optical component, a first spacer, a second optical component, at least a first via plug, and an adhesion material. The first spacer includes at least a first via plug passing through the first spacer, wherein the first optical component and the second optical component are separated by the first spacer. The adhesion material is coated in between the first optical component and the first spacer and coated in between the first spacer and the second optical component, and is filled in at least a portion of the first via plug.