Patents by Inventor Chuan-Ching Wang
Chuan-Ching Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11852672Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: GrantFiled: July 27, 2022Date of Patent: December 26, 2023Assignee: TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LIMITEDInventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Publication number: 20220357389Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: ApplicationFiled: July 27, 2022Publication date: November 10, 2022Inventors: Mill-Jer WANG, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Patent number: 11467203Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: GrantFiled: July 27, 2020Date of Patent: October 11, 2022Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Publication number: 20200355737Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: ApplicationFiled: July 27, 2020Publication date: November 12, 2020Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Patent number: 10725090Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: GrantFiled: February 9, 2018Date of Patent: July 28, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Publication number: 20180164365Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.Type: ApplicationFiled: February 9, 2018Publication date: June 14, 2018Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Mill-Jer WANG, Ching-Nen PENG, Hung-Chih LIN, Sen-Kuei HSU, Chuan-Ching WANG, Hao CHEN
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Patent number: 9891266Abstract: A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.Type: GrantFiled: February 25, 2014Date of Patent: February 13, 2018Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
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Publication number: 20150241507Abstract: A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.Type: ApplicationFiled: February 25, 2014Publication date: August 27, 2015Applicant: Taiwan Semiconductor Manufacturing CO., LTD.Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen