Patents by Inventor Chuan-Ching Wang

Chuan-Ching Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11852672
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTORMANUFACTURING COMPANY LIMITED
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Publication number: 20220357389
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Inventors: Mill-Jer WANG, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Patent number: 11467203
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: October 11, 2022
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Publication number: 20200355737
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Patent number: 10725090
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: July 28, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Publication number: 20180164365
    Abstract: A method that is disclosed that includes the operations outlined below. Dies are arranged on a test fixture, and each of the dies includes first antennas and at least one via array, wherein the at least one via array is formed between at least two of the first antennas to separate the first antennas. By the first antennas of the dies, test processes are sequentially performed on an under-test device including second antennas that positionally correspond to the first antennas, according to signal transmissions between the first antennas and the second antennas.
    Type: Application
    Filed: February 9, 2018
    Publication date: June 14, 2018
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Mill-Jer WANG, Ching-Nen PENG, Hung-Chih LIN, Sen-Kuei HSU, Chuan-Ching WANG, Hao CHEN
  • Patent number: 9891266
    Abstract: A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: February 13, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen
  • Publication number: 20150241507
    Abstract: A method is disclosed that includes the operations outlined below. For a plurality of dies on a test fixture, an antenna distance between each of first antennas of one of the dies and every one of first antennas of the other dies is determined. The dies are categorized into die groups, wherein the antenna distance between each of the first antennas of one of the dies in one of the die groups and every one of the first antennas of the other dies in the same one of the die groups is larger than an interference threshold. Test processes are sequentially performed on the die groups. Each of the test processes is performed according to signal transmissions between the first antennas and second antennas of the under-test device each positionally corresponds to one of the first antennas.
    Type: Application
    Filed: February 25, 2014
    Publication date: August 27, 2015
    Applicant: Taiwan Semiconductor Manufacturing CO., LTD.
    Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen