Abstract: A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

Abstract: A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).

Abstract: A step sporting equipment with a double transmission mechanism, wherein a transmission mechanism and a treading mechanism are located on both sides of a frame body respectively. Each transmission mechanism at least comprises a front wheel disc, a rear wheel disc and a driving piece. Each treading mechanism is connected to the corresponding transmission mechanism. When the user treads on each treading mechanism, each treading mechanism can compel the corresponding transmission mechanism to work. In addition, as the front wheel disc and rear wheel disc are linked by a driving piece, there is higher moving phase. Therefore, with two transmission mechanisms, the dimensional discrepancy of elements resulted from tolerance can be tolerated effectively, and the step sporting equipment can remain in normal operation.

Abstract: An antenna structure includes a metallic member, a feed portion, and a coupling resistor. The metallic member defines a slot, a first gap, a second gap, and a third gap. The first gap and the second gap are connected with the slot and divide with the slot the metallic member into a first portion and a second portion. The second portion is grounded. The third gap is defined on the first portion and connected with the slot. The first portion is divided into a radiating portion and a coupling portion by the third gap. The coupling portion is spaced apart from the radiating portion. The feed portion is electrically connected to the radiating portion, and the coupling portion is grounded through the coupling resistor.

Abstract: The present disclosure relates to a semiconductor device package including a substrate, a semiconductor device and an underfill. The substrate has a first surface and a second surface angled with respect to the first surface. The semiconductor device is mounted on the first surface of the substrate and has a first surface facing the first surface of the substrate and a second surface angled with respect to the first surface of the substrate. The underfill is disposed between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate is located in the substrate and external to a vertical projection of the semiconductor device on the first surface of the substrate.

Abstract: A super thin heating disk includes an upper cover made of metal, the upper cover being formed with a receiving groove; a lower cover made of metal and installed within the receiving groove; the heating coil being distributed in the receiving groove; a heating coil installed within the receiving groove, two ends of the heating coil being installed with two electrodes, respectively, which are connected to external positive and negative electrodes for current conduction; a thermal couple installed in the receiving groove for detecting temperatures of the heating coil; the thermal couple being connected to two connection wires for conducting external transmission lines so that detection temperature data can be transferred out; and two insulation layers installed in the receiving groove and at an upper and a lower side of the heating coil.

Abstract: The present disclosure relates to a semiconductor device package including a substrate, a semiconductor device and an underfill. The substrate has a first surface and a second surface angled with respect to the first surface. The semiconductor device is mounted on the first surface of the substrate and has a first surface facing the first surface of the substrate and a second surface angled with respect to the first surface of the substrate. The underfill is disposed between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate is located in the substrate and external to a vertical projection of the semiconductor device on the first surface of the substrate.

Abstract: A PVD reactor with a function of alignment in covering an upper cover includes a cavity having a first contact surface; an interior of the cavity having a metal isolation plate; an upper cover pivotally installed to the cavity; the upper cover having a second contact surface which is positioned corresponding to the first contact surface of the cavity; the upper cover being capable of being combined with a target; a plurality of semi-spherical recesses in the first contact surface of the cavity; and a plurality of semi-spherical protrusions in the second contact surface; when the upper cover covers upon the cavity, the plurality of semi-spherical protrusions will embed into the plurality of semi-spherical recesses.

Abstract: A vapor reduction device for a semiconductor wafer has a plurality of heat plates which are spaced arranged longitudinally for receiving a plurality of wafers, the heat plates are integrated into a heating frame which is further placed into a casing. The movements of the heat plates within the casing causes that the wafers can be heated rapidly and uniformly so as to evaporated vapor effectively. The heat plates are separable from the heating frame and thus a number of the heat plates is selectable as desired. The heating temperature for the heat plates is controllable independently so that the temperatures of the wafers are controllable so that the temperature differences of the wafers are controllable to be uniformly distributed.

Abstract: A spent sulfuric acid catalyst from an alkylation unit is regenerated via a paired oxidation electrolysis, wherein active intermediates are generated via both anodic oxidation and cathodic reduction without adding an additional organic peroxide during the electrolysis. The organic impurities in the spent sulfuric acid catalyst are decomposed by the active intermediates, and removed therefrom via evaporation.

Abstract: A plasma etching reaction chamber includes a casing having a receiving chamber; a base liftably installed below the receiving chamber; a first electrode and a second electrode; and a radio frequency electrode rod. The second electrode has a plurality of water channels and a bottom of the second electrode is installed with two cooling water tubes which are communicated with the plurality of water channels; upper sides of the two cooling water tubes are hidden within the driving rod and lower sides thereof extend downwards to be out of the casing so that external cooling water can flow into the cooling water tubes and then to the water channels to achieve the object of cooling.

Abstract: A process for producing a modified polyphenylene ether resin having a purity of more than 99.4%, comprising steps of graft modification, water rinse, and extraction as well as phase splitting, is disclosed that step of separating out powder during purification is no needed, and the solvent for use in performing dissolving of or/and extraction of polyphenylene ether resin can be recycled for future use, so that the manufacturing process is simple and uses less solvent as compared to the prior art, and further helps to conserve resources and is environmentally friendly.

Abstract: The present invention discloses a manufacturing method for a paper protective shell of a mobile device, comprising: selecting a paper material, and mixing the paper material with water to form a paper pulp; performing a mould press manner to press the paper pulp to form a shell by using a mold, and separating the shell from the mold to dry the shell; and performing an appearance color treatment to color an outer surface of the shell; wherein the colored shell is a final product after finishes the appearance color treatment, and the final product is the paper protective shell of the mobile device, and the paper protective shell is used to combine with the mobile device.

Abstract: The present invention discloses a container with synchronous rising and lowering functions, which is configured to contain an article. The container comprises: a box body, having a containing space therein; a cover unit, connecting one side thereof to one side of an upper edge of the box body; a lifting unit, locating in the containing space for being placed the article; and a connection unit, connecting the cover unit and the lifting unit, wherein when the cover unit is opened, the cover unit is linked with the connection unit to allow the connection unit to drive the lifting unit to rise synchronously, and when the cover unit is enclosed, the cover unit is linked with the connection unit to allow the connection unit to drive the lifting unit to lower synchronously.

Abstract: The present invention discloses a container with synchronous rising and lowering functions, which is configured to contain an article. The container comprises: a box body, having a containing space therein; a cover unit, connecting one side thereof to one side of an upper edge of the box body; a lifting unit, locating in the containing space for being placed the article; and a connection unit, connecting the cover unit and the lifting unit, wherein when the cover unit is opened, the cover unit is linked with the connection unit to allow the connection unit to drive the lifting unit to rise synchronously, and when the cover unit is enclosed, the cover unit is linked with the connection unit to allow the connection unit to drive the lifting unit to lower synchronously.

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: A spent sulfuric acid catalyst from an alkylation unit is regenerated via a paired oxidation electrolysis, wherein active intermediates are generated via both anodic oxidation and cathodic reduction without adding an additional organic peroxide during the electrolysis. The organic impurities in the spent sulfuric acid catalyst are decomposed by the active intermediates, and removed therefrom via evaporation.