Patents by Inventor Chuan-Chung Hsieh

Chuan-Chung Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Easily assembled transceiver module with high yield rate
    Patent number: 6659657
    Abstract: The transceiver module includes a lower housing, a board, a transmitting subassembly, a receiving subassembly, a lower housing and a clamp. The transmitting subassembly further includes a laser diode pack, a lower sleeve and an upper sleeve. The laser diode pack is plugged into one terminal of the lower sleeve. Besides, the lower sleeve connects the laser diode pack with the upper sleeve. The upper sleeve has a flange formed on a middle of the upper sleeve. Via the flange, the groove of the lower housing fixes the transmitting subassembly. The lower housing is connected to the lower housing and encapsulating the board, the transmitting subassembly and the receiving subassembly.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: December 9, 2003
    Assignee: Delta Electronics Inc.
    Inventors: You-Nain Lin, Chuan-Chung Hsieh
  • Easily assembled transceiver module with high yield rate
    Publication number: 20020181901
    Abstract: The transceiver module includes a lower housing, a board, a transmitting subassembly, a receiving subassembly, a lower housing and a clamp. The transmitting subassembly further includes a laser diode pack, a lower sleeve and an upper sleeve. The laser diode pack is plugged into one terminal of the lower sleeve. Besides, the lower sleeve connects the laser diode pack with the upper sleeve. The upper sleeve has a flange formed on a middle of the upper sleeve. Via the flange, the groove of the lower housing fixes the transmitting subassembly. The lower housing is connected to the lower housing and encapsulating the board, the transmitting subassembly and the receiving subassembly.
    Type: Application
    Filed: December 11, 2001
    Publication date: December 5, 2002
    Inventors: You-Nain Lin, Chuan-Chung Hsieh