Abstract: The present disclosure relates to the field of image definition recognition, and discloses a logging image definition recognition method and device, medium and electronic equipment. The method comprises: establishing a logging image sample library comprising a plurality of logging images; acquiring actual definition information corresponding to the respective logging images; acquiring a plurality of definitions corresponding to the respective logging images; determining target weights corresponding to the respective target image definition determination algorithms according to the plurality of definitions and the actual definition information corresponding to the respective logging images; and determining a definition of a target logging image by the respective target image definition determination algorithms and the target weights corresponding to the respective target image definition determination algorithms.

Abstract: Provided herein are novel pyrazoloquinolinone compounds and method of using such compounds to treat disorders such as neuropsychiatric disorders with sensorimotor gating deficits, such as schizophrenia, tic disorders, attention deficit hyperactivity disorder, obsessive compulsive disorder, panic disorder, Huntington's disease and nocturnal enuresis; depression; temporomandibular myofascial pain; disorders of trigeminal nerve, such as trigeminal neuralgia and trigeminal neuropathy; migraine; and tinnitus.

Abstract: Provided is a method for preparing hispidulin or a derivative thereof. The method includes selective protection of trihydroxybenzaldehyde, followed by regioselective iodination, selective protection, Stille coupling, Baeyer-Villiger oxidation and basic hydrolysis to obtain a protected intermediate compound. Then, alkylation, Claisen-Schmidt condensation, cyclization and deprotection of the protected intermediate compound are performed to obtain hispidulin or the derivative thereof. The present disclosure provides an efficient method for total synthesis of hispidulin or the derivative thereof with concise reaction steps and high yield.

Abstract: Provided is a method for preparing hispidulin or a derivative thereof. The method includes selective protection of trihydroxybenzaldehyde, followed by regioselective iodination, selective protection, Stille coupling, Baeyer-Villiger oxidation and basic hydrolysis to obtain a protected intermediate compound. Then, alkylation, Claisen-Schmidt condensation, cyclization and deprotection of the protected intermediate compound are performed to obtain hispidulin or the derivative thereof. The present disclosure provides an efficient method for total synthesis of hispidulin or the derivative thereof with concise reaction steps and high yield.

Abstract: Provided herein are novel pyrazolo-quinolinone compounds and method of using such compounds to treat disorders such as neuropsychiatric disorders with sensorimotor gating deficits, such as schizophrenia, tic disorders, attention deficit hyperactivity disorder, obsessive compulsive disorder, panic disorder, Huntington's disease and nocturnal enuresis;depression; temporomandibular myofascial pain; disorders of trigeminal nerve, such as trigeminal neuralgia and trigeminal neuropathy; migraine; and tinnitus.

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract: A broadband antenna includes first and second radiating conductors. The first radiating conductor includes a short-circuit portion in a serpentine shape, a first radiating arm resonating in a first frequency band, and a second radiating arm. The second radiating conductor includes a feed-in portion coupling with the first radiating arm, a third radiating arm resonating in a second frequency band, and a fourth radiating arm. At least a part of the third radiating arm is in a serpentine shape, couples with the first radiating arm, and resonates in a third frequency band with the short-circuit portion and the second radiating arm. The fourth radiating arm resonates in a fourth frequency band.

Abstract: A wideband antenna includes a grounding element; a feed-in terminal; a first radiating unit, electrically connected to the feed-in terminal and extending from the feed-in terminal toward a first direction; a second radiating unit, electrically connected to the feed-in terminal, extending from the feed-in terminal toward a second direction, and including a meander-shaped element; and a third radiating unit, electrically connected to the grounding element, extending from the grounding element toward the first radiating unit and the second radiating unit, and having one segment parallel to the meander-shaped element, for coupling the meander-shaped element.

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract: A broadband antenna includes first and second radiating conductors. The first radiating conductor includes a short-circuit portion in a serpentine shape, a first radiating arm resonating in a first frequency band, and a second radiating arm. The second radiating conductor includes a feed-in portion coupling with the first radiating arm, a third radiating arm resonating in a second frequency band, and a fourth radiating arm. At least a part of the third radiating arm is in a serpentine shape, couples with the first radiating arm, and resonates in a third frequency band with the short-circuit portion and the second radiating arm. The fourth radiating arm resonates in a fourth frequency band.

Abstract: A substrate structure and a package structure using the same are provided. The substrate structure includes a number of traces, a substrate core and a number of first metal tiles. The substrate core has a first surface and a second surface opposite to the first surface. The first metal tiles are disposed on one of the first surface and the second surface, the minimum pitch between adjacent two of the first metal tiles is the minimum process pitch.

Abstract: Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Abstract: A wideband antenna includes a grounding element; a feed-in terminal; a first radiating unit, electrically connected to the feed-in terminal and extending from the feed-in terminal toward a first direction; a second radiating unit, electrically connected to the feed-in terminal, extending from the feed-in terminal toward a second direction, and including a meander-shaped element; and a third radiating unit, electrically connected to the grounding element, extending from the grounding element toward the first radiating unit and the second radiating unit, and having one segment parallel to the meander-shaped element, for coupling the meander-shaped element.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.

Abstract: The present invention relates to the use of a composition made from Clerodendrum for treating tic disorder or sensorimotor gating deficits, wherein the composition is particularly made from the leaves of the plant.

Abstract: The present invention relates to the use of a composition made from Clerodendrum for treating tic disorder or sensorimotor gating deficits, wherein the composition is particularly made from the leaves of the plant.

Abstract: Described herein are wafer-level semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes: (1) a semiconductor device; (2) a package body covering lateral surfaces of the semiconductor device, a lower surface of the package body and a lower surface of the semiconductor device defining a front surface; (3) a set of redistribution layers disposed adjacent to the front surface, the set of redistribution layers including a grounding element that includes a connection surface electrically exposed adjacent to at least one lateral surface of the set of redistribution layers; and (4) an EMI shield disposed adjacent to the package body and electrically connected to the connection surface of the grounding element. The grounding element provides an electrical pathway to ground electromagnetic emissions incident upon the EMI shield.

Abstract: A substrate structure and a package structure using the same are provided. The substrate structure includes a number of traces, a substrate core and a number of first metal tiles. The substrate core has a first surface and a second surface opposite to the first surface. The first metal tiles are disposed on one of the first surface and the second surface, the minimum pitch between adjacent two of the first metal tiles is the minimum process pitch.

Abstract: Described herein are semiconductor device packages with EMI shielding and related methods. In one embodiment, a semiconductor device package includes a grounding element disposed adjacent to a periphery of a substrate unit and at least partially extending between an upper surface and a lower surface of the substrate unit. The grounding element includes an indented portion that is disposed adjacent to a lateral surface of the substrate unit. The semiconductor device package also includes an EMI shield that is electrically connected to the grounding element and is inwardly recessed adjacent to the indented portion of the grounding element.

Abstract: A manufacturing method for package structure is provided. The manufacturing method includes the follow steps. Firstly, a substrate is provided. Next, a number of chips are provided. Then, the chips are electrically connected with the substrate. After that, the chips are encapsulated with a sealant, so that the chips and the substrate form a package. Then, the package is adhered by a vacuum force. Afterwards, the adhered package is singulated to form many package structures along the portion between adjacent two of airways.