Patents by Inventor CHUAN-FANG SU

CHUAN-FANG SU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9754064
    Abstract: An IC design method includes: receiving a first layout including a first pattern; receiving a second layout including a second pattern, the first pattern separated from the second pattern when overlapping the first layout and the second layout; providing a cut pattern between the first pattern and the second pattern and overlapping the first pattern when overlapping the first layout, the second layout and the cut pattern; and providing a jog extending from the cut pattern to further overlap the first pattern with a length when a spacing between the second pattern and an edge of the cut pattern overlapping the first pattern is lower than a predetermined value, in which a ratio of the length of the jog to the spacing between the second pattern and the edge of the cut pattern overlapping the first pattern is in a range of 1/5 to 1/1.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: September 5, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuan-Fang Su, Kun-Zhi Chung, Yuan-Hsiang Lung
  • Publication number: 20170024507
    Abstract: An IC design method includes: receiving a first layout including a first pattern; receiving a second layout including a second pattern, the first pattern separated from the second pattern when overlapping the first layout and the second layout; providing a cut pattern between the first pattern and the second pattern and overlapping the first pattern when overlapping the first layout, the second layout and the cut pattern; and providing a jog extending from the cut pattern to further overlap the first pattern with a length when a spacing between the second pattern and an edge of the cut pattern overlapping the first pattern is lower than a predetermined value, in which a ratio of the length of the jog to the spacing between the second pattern and the edge of the cut pattern overlapping the first pattern is in a range of 1/5 to 1/1.
    Type: Application
    Filed: October 5, 2016
    Publication date: January 26, 2017
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuan-Fang SU, Kun-Zhi CHUNG, Yuan-Hsiang LUNG
  • Patent number: 9477804
    Abstract: An IC design method includes: receiving a first layout including a first pattern; receiving a second layout including a second pattern, the first pattern separated from the second pattern when overlapping the first layout and the second layout; providing a cut pattern between the first pattern and the second pattern and overlapping the first pattern when overlapping the first layout, the second layout and the cut pattern; and providing a jog extending from the cut pattern to further overlap the first pattern with a length when a spacing between the second pattern and an edge of the cut pattern overlapping the first pattern is lower than a predetermined value, in which a ratio of the length of the jog to the spacing between the second pattern and the edge of the cut pattern overlapping the first pattern is in a range of 1/5 to 1/1.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: October 25, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chuan-Fang Su, Kun-Zhi Chung, Yuan-Hsiang Lung
  • Publication number: 20160210395
    Abstract: An IC design method includes: receiving a first layout including a first pattern; receiving a second layout including a second pattern, the first pattern separated from the second pattern when overlapping the first layout and the second layout; providing a cut pattern between the first pattern and the second pattern and overlapping the first pattern when overlapping the first layout, the second layout and the cut pattern; and providing a jog extending from the cut pattern to further overlap the first pattern with a length when a spacing between the second pattern and an edge of the cut pattern overlapping the first pattern is lower than a predetermined value, in which a ratio of the length of the jog to the spacing between the second pattern and the edge of the cut pattern overlapping the first pattern is in a range of 1/5 to 1/1.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 21, 2016
    Inventors: Chuan-Fang SU, Kun-Zhi CHUNG, Yuan-Hsiang LUNG
  • Patent number: 9235676
    Abstract: Some embodiments of the present disclosure provide an integrated circuit (IC) design method. The method includes (1) receiving a first layout comprising stripe patterns with a first separation and a first width; (2) receiving a second layout comprising stripe patterns with a second width narrower than the first separation, each stripe on the second layout is configured to situate between two adjacent stripes on the first layout when overlaying the first layout and the second layout; (3) performing a separation check by identifying a spacing between a stripe on the second layout and one of the two adjacent stripes on the first layout; and (4) adjusting the spacing between the stripe on the second layout and one of the two adjacent stripes on the first layout when the separation check determining the spacing is greater than a predetermined value.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: January 12, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chuan-Fang Su, Chih-Chun Hsu, Hsing-Wang Chen, Rung-Shiang Chen, Ching-Juinn Huang
  • Publication number: 20150310156
    Abstract: Some embodiments of the present disclosure provide an integrated circuit (IC) design method. The method includes (1) receiving a first layout comprising stripe patterns with a first separation and a first width; (2) receiving a second layout comprising stripe patterns with a second width narrower than the first separation, each stripe on the second layout is configured to situate between two adjacent stripes on the first layout when overlaying the first layout and the second layout; (3) performing a separation check by identifying a spacing between a stripe on the second layout and one of the two adjacent stripes on the first layout; and (4) adjusting the spacing between the stripe on the second layout and one of the two adjacent stripes on the first layout when the separation check determining the spacing is greater than a predetermined value.
    Type: Application
    Filed: April 25, 2014
    Publication date: October 29, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: CHUAN-FANG SU, CHIH-CHUN HSU, HSING-WANG CHEN, RUNG-SHIANG CHEN, CHING-JUINN HUANG