Patents by Inventor Chuan-Hua Chen
Chuan-Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7334630Abstract: Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These micropumps are fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These micropumps also can allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the spatial and temporal characteristics of the device temperature profiles. Novel enclosed microchannel structures are also described.Type: GrantFiled: May 25, 2005Date of Patent: February 26, 2008Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Patent number: 7316543Abstract: An electroosmotic micropump having a plurality of thin, closely-spaced, approximately planar, transversel aligned partitions formed in or on a substrate, among which electroosmotic flow (EOF) is generated. Electrodes are located within enclosed inlet and outlet manifolds on either side of the partition array. Inlet and outlet ports enable fluid to be pumped into and through the micropump and through an external friction load or head. Insulating layer coatings on the formed substrate limit substrate leakage current during pumping operation.Type: GrantFiled: May 30, 2003Date of Patent: January 8, 2008Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Thomas W. Kenny, Juan G. Santiago, Daniel J. Laser, Chuan-Hua Chen
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Patent number: 7185697Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: GrantFiled: September 2, 2004Date of Patent: March 6, 2007Assignee: Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Patent number: 7131486Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: GrantFiled: March 10, 2003Date of Patent: November 7, 2006Assignee: The Board of Trustees of the Leland Stanford Junior UniverstyInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Patent number: 6991024Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: GrantFiled: June 27, 2003Date of Patent: January 31, 2006Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Publication number: 20050205241Abstract: Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These micropumps are fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These micropumps also can allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the spatial and temporal characteristics of the device temperature profiles. Novel enclosed microchannel structures are also described.Type: ApplicationFiled: May 25, 2005Publication date: September 22, 2005Inventors: Kenneth Goodson, Chuan-Hua Chen, David Huber, Linan Jiang, Thomas Kenny, Jae-Mo Koo, Daniel Laser, James Mikkelsen, Juan Santiago, Evelyn Wang, Shulin Zeng, Lian Zhang
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Patent number: 6942018Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: GrantFiled: January 19, 2002Date of Patent: September 13, 2005Assignee: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Publication number: 20050098299Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long,-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: ApplicationFiled: September 2, 2004Publication date: May 12, 2005Inventors: Kenneth Goodson, Chuan-Hua Chen, David Huber, Linan Jiang, Thomas Kenny, Jae-Mo Koo, Daniel Laser, James Mikkelsen, Juan Santiago, Evelyn Wang, Shulin Zeng, Lian Zhang
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Publication number: 20040241004Abstract: An electroosmotic micropump having a plurality of planar features formed in a substrate to form an electroosmotic flow (EOF) pumping region. Inlet and outlet manifolds on either side of the pumping region to enable fluid to be pumped into and through the micropump. A cover is bonded to the substrate to seal the pumping region and manifolds. An insulating layer coating is applied to the formed substrate to reduce current flow when an electric filed is applied during pumping operation. An additional layer is applied on top of the insulating layer to provide electrochemistry at the liquid-solid interface in the electroosmotic micropump that enhances micropump performance.Type: ApplicationFiled: May 30, 2003Publication date: December 2, 2004Inventors: Kenneth E. Goodson, Thomas W. Kenny, Juan G. Santiago, Daniel J. Laser, Chuan-Hua Chen
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Publication number: 20040089442Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: ApplicationFiled: June 27, 2003Publication date: May 13, 2004Applicant: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evely Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Publication number: 20030164231Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: ApplicationFiled: March 10, 2003Publication date: September 4, 2003Applicant: The Board of Trustees of the Leland Stanford Junior UniversityInventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang
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Publication number: 20030062149Abstract: Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles.Type: ApplicationFiled: January 19, 2002Publication date: April 3, 2003Inventors: Kenneth E. Goodson, Chuan-Hua Chen, David E. Huber, Linan Jiang, Thomas W. Kenny, Jae-Mo Koo, Daniel J. Laser, James C. Mikkelsen, Juan G. Santiago, Evelyn Ning-Yi Wang, Shulin Zeng, Lian Zhang