Patents by Inventor Chuan-Hung CHENG

Chuan-Hung CHENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145691
    Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.
    Type: Application
    Filed: March 14, 2023
    Publication date: May 2, 2024
    Inventors: CHUAN-PU LIU, YIN-WEI CHENG, SHIH-AN WANG, BO-LIANG PENG, CHUN-HUNG CHEN, JUN-HAN HUANG, YI-CHANG LI
  • Patent number: 11950521
    Abstract: A resistive random-access memory (RRAM) device includes a bottom electrode, a high work function layer, a resistive material layer, a top electrode and high work function spacers. The bottom electrode, the high work function layer, the resistive material layer and the top electrode are sequentially stacked on a substrate, wherein the resistive material layer includes a bottom part and a top part. The high work function spacers cover sidewalls of the bottom part, thereby constituting a RRAM cell. The present invention also provides a method of forming a RRAM device.
    Type: Grant
    Filed: May 11, 2022
    Date of Patent: April 2, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Shu-Hung Yu, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240107901
    Abstract: Provided is a resistive random access memory (RRAM). The resistive random access memory includes a plurality of unit structures disposed on a substrate. Each of the unit structures includes a first electrode, and a first metal oxide layer. The first electrode is disposed on the substrate. The first metal oxide layer is disposed on the first electrode. In addition, the resistive random access memory includes a second electrode. The second electrode is disposed on the plurality of unit structures and connected to the plurality of unit structures.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Kai Jiun Chang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240074338
    Abstract: A resistive random access memory (RRAM) structure includes a RRAM cell, spacers and a dielectric layer. The RRAM cell is disposed on a substrate. The spacers are disposed beside the RRAM cell, wherein widths of top surfaces of the spacers are larger than or equal to widths of bottom surfaces of the spacers. The dielectric layer blanketly covers the substrate and sandwiches the RRAM cell, wherein the spacers are located in the dielectric layer. A method for forming the resistive random access memory (RRAM) structure is also provided.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Publication number: 20240074335
    Abstract: A RRAM device includes a bottom electrode, a resistive material layer, atop electrode, a hard mask and high work function sidewall parts. The bottom electrode, the resistive material layer, the top electrode and the hard mask are sequentially stacked on a substrate. The high work function sidewall parts cover sidewalls of the top electrode and sidewalls of the hard mask, thereby constituting a RRAM cell. A method of forming the RRAM device is also provided.
    Type: Application
    Filed: November 8, 2023
    Publication date: February 29, 2024
    Applicant: UNITED MICROELCTRONICS CORP.
    Inventors: Wen-Jen Wang, Chun-Hung Cheng, Chuan-Fu Wang
  • Patent number: 8878898
    Abstract: A smart 3D HDMI video splitter is disclosed. When a 3D video signal enters the smart splitter, a field-programmable gate array converts the 3D signal so that the smart 3D HDMI video splitter outputs a 3D or 2D signal according to the type of the television, display or AVR amplifier.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: November 4, 2014
    Assignee: DA2 Technologies Corporation
    Inventors: Chuan-Hung Cheng, Chin-Shih Chang, Shu-Cheng Liu
  • Publication number: 20130182068
    Abstract: A smart 3D HDMI video splitter is disclosed. When a 3D video signal enters the smart splitter, a field-programmable gate array converts the 3D signal so that the smart 3D HDMI video splitter outputs a 3D or 2D signal according to the type of the television, display or AVR amplifier.
    Type: Application
    Filed: September 14, 2012
    Publication date: July 18, 2013
    Applicant: DA2 Technologies Corporation
    Inventors: Chuan-Hung CHENG, Chin-Shih Chang, Shu-Cheng Liu
  • Publication number: 20120154374
    Abstract: A 3D image conversion system is disclosed. A 3D image signal is input via HDMI to a field programmable gate array for conversion. The result is output via HDMI to a 3D display. By converting the 3D image signal into checkboard, field/frame sequential, or line interlaced signal, the invention enables a DLP, PDP, or LCD 3D display etc. to support several 3D image structure.
    Type: Application
    Filed: December 16, 2010
    Publication date: June 21, 2012
    Applicant: DA2 Technologies Corporation
    Inventors: Chuan-Hung CHENG, Kuen-Yi Chiang