Patents by Inventor Chuan-Jong Wang

Chuan-Jong Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming contact plugs for eliminating tungsten seam issue
    Publication number: 20080217775
    Abstract: A method of forming a contact plug of an eDRAM device includes the following steps: forming a tungsten layer with tungsten seam on a dielectric layer to fill a contact hole; removing the tungsten layer from the top surface of the dielectric layer, recessing the tungsten layer in the contact hole to form a recess of about 600˜900 Angstroms in depth below the top surface of the dielectric layer, depositing a conductive layer on the dielectric layer and the recessed tungsten plug to fill the recess; and removing the conductive layer from the top surface of the dielectric layer to form a conductive plug on the recessed tungsten plug in the contact hole.
    Type: Application
    Filed: March 7, 2007
    Publication date: September 11, 2008
    Inventors: Chih-Yang Pai, Wen-Chuan Chiang, Chung-Yi Yu, Yeur-Luen Tu, Yuan-Hung Liu, Hsiang-Fan Lee, Chuan-Jong Wang