Abstract: A redundant power supply device comprises a first processing unit, for filtering and rectifying a first input power source, to generate a first output power source; a second processing unit, for filtering and rectifying a second input power source, to generate a second output power source; a common connection unit, coupled to the first processing unit and the second processing unit, for generating a direct current (DC) power source according to the first output power source and the second output power source; and a DC-DC conversion unit, coupled to the common connection unit, for converting the DC power source to a DC output power source.

Abstract: A common mode inductor apparatus includes a magnetic core, a first coil winding and a second coil winding. The magnetic core has a first winding zone and a second winding zone. The first coil winding is wound in three winding areas within the first winding zone, wherein two neighboring winding areas within the first winding zone are separated by a gap. The second coil winding is wound in three winding areas within the second winding zone, wherein two neighboring winding areas within the second winding zone are separated by a gap.

Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

Abstract: The present invention discloses an electromagnetic shielding assembly including an electromagnetic interference shielding component including a plate body and a bending portion. An included angle is formed between the plate body and the bending portion, and the plate body and the bending portion cover an input socket of a power supply. The electromagnetic interference shielding component includes at least one grounding pin disposed on the plate body or/and the bending portion and configured to ground with and screw to a housing of the power supply, and a welding pin disposed on a side of the bending portion away from the plate body and electrically connected to an auxiliary circuit board. The electromagnetic interference shielding component provides functions of EMI shielding, lightning (current) discharging and fixture, which can simplify the structure, increase the discharging speed and time, and reduce the amount of disturbance of the large current instantaneous to the ground.

Abstract: The invention discloses a circuit board output structure, which includes a power output section disposed on a circuit board and at least one metal connection stand electrically connected to the power output section. Each metal connection stand includes a first connection piece showing an included angle with respect to the circuit board. A plurality of connection holes for electrically connecting output wires are formed on the first connection piece. When it is required to change an output specification, the replacement can be more simple and convenient since the metal connection stand may be directly replaced without replacing the whole circuit board. Because the first connection piece has the included angle specified with respect to the circuit board, R angle and stress of the inserted output wires may be reduced to prevent the output wires from damage, detaching from the circuit board or having poor electrical contact after the assembly.

Abstract: The invention discloses a circuit board output structure, which includes a power output section disposed on a circuit board and at least one metal connection stand electrically connected to the power output section. Each metal connection stand includes a first connection piece showing an included angle with respect to the circuit board. A plurality of connection holes for electrically connecting output wires are formed on the first connection piece. When it is required to change an output specification, the replacement can be more simple and convenient since the metal connection stand may be directly replaced without replacing the whole circuit board. Because the first connection piece has the included angle specified with respect to the circuit board, R angle and stress of the inserted output wires may be reduced to prevent the output wires from damage, detaching from the circuit board or having poor electrical contact after the assembly.

Abstract: A power supply system includes a power conversion circuit, a conversion control circuit, an auxiliary power module, an electricity supply module and a power supply control circuit. The power conversion circuit converts an input power into an output power used as an output of the power supply system. The conversion control circuit is arranged for controlling an operation of the power conversion circuit according to a control power. The auxiliary power module is arranged for selectively outputting a first electrical power to the conversion control circuit. The electricity supply module is arranged for providing a second electrical power. The power supply control circuit is coupled to the auxiliary power module and the electricity supply module, and arranged for referring to at least the second electrical power to determine whether to provide the first electrical power or the second electrical power as the control power for the conversion control circuit.

Abstract: A common mode inductor apparatus includes a magnetic core, a first coil winding and a second coil winding. The magnetic core has a first winding zone and a second winding zone. The first coil winding is wound in three winding areas within the first winding zone, wherein two neighboring winding areas within the first winding zone are separated by a gap. The second coil winding is wound in three winding areas within the second winding zone, wherein two neighboring winding areas within the second winding zone are separated by a gap.

Abstract: A power supply system includes a power conversion circuit, a conversion control circuit, an auxiliary power module, an electricity supply module and a power supply control circuit. The power conversion circuit converts an input power into an output power used as an output of the power supply system. The conversion control circuit is arranged for controlling an operation of the power conversion circuit according to a control power. The auxiliary power module is arranged for selectively outputting a first electrical power to the conversion control circuit. The electricity supply module is arranged for providing a second electrical power. The power supply control circuit is coupled to the auxiliary power module and the electricity supply module, and arranged for referring to at least the second electrical power to determine whether to provide the first electrical power or the second electrical power as the control power for the conversion control circuit.

Abstract: A power supply apparatus is provided, which includes an input conversion stage, a main power conversion circuit, an auxiliary power conversion circuit, a switching unit and a buck power conversion circuit. The input conversion stage is used for receiving an AC voltage and converting the AC voltage to output a DC input voltage. The main power conversion circuit is used for converting the DC input voltage so as to generate and output a main power. The auxiliary power conversion circuit is used for converting the DC input voltage so as to generate and output an auxiliary power. The switching unit is used for receiving the main power and the auxiliary power and selecting and outputting one of the main power and the auxiliary power. The buck power conversion circuit is used for stepping down the output of the switching unit so as to generate and output a standby power.

Abstract: A stacked structure for patterning a material layer to form an opening pattern with a predetermined opening width in the layer is provided. The stacked structure includes an underlayer, a silicon rich organic layer, and a photoresist layer. The underlayer is on the material layer. The silicon rich organic layer is between the underlayer and the photoresist layer. The thickness of the photoresist layer is smaller than that of the underlayer and larger than two times of the thickness of the silicon rich organic layer. The thickness of the underlayer is smaller than three times of the predetermined opening width.

Abstract: A stacked structure for patterning a material layer to form an opening pattern with a predetermined opening width in the layer is provided. The stacked structure includes an underlayer, a silicon rich organic layer, and a photoresist layer. The underlayer is on the material layer. The silicon rich organic layer is between the underlayer and the photoresist layer. The thickness of the photoresist layer is smaller than that of the underlayer and larger than two times of the thickness of the silicon rich organic layer. The thickness of the underlayer is smaller than three times of the predetermined opening width.

Abstract: A method of fabricating spacers is provided. The method includes providing a substrate with a device structure formed thereon. The device structure comprises a gate structure and a pair of source/drain regions. Then, a spacer material layer is formed over the substrate to cover the substrate and the device structure. Thereafter, an etching process is performed to remove a portion of the spacer material layer so that spacers are formed on the respective sidewalls of the gate structure. After that, a plasma treatment step is performed to form a spacer protection layer on the surface of the substrate, the spacers and the gate structure.

Abstract: A stacked structure for patterning a material layer to form an opening pattern with a predetermined opening width in the layer is provided. The stacked structure includes an underlayer, a silicon rich organic layer, and a photoresist layer. The underlayer is on the material layer. The silicon rich organic layer is between the underlayer and the photoresist layer. The thickness of the photoresist layer is smaller than that of the underlayer and larger than two times of the thickness of the silicon rich organic layer. The thickness of the underlayer is smaller than three times of the predetermined opening width.

Abstract: A method of fabricating spacers is provided. The method includes providing a substrate with a device structure formed thereon. The device structure comprises a gate structure and a pair of source/drain regions. Then, a spacer material layer is formed over the substrate to cover the substrate and the device structure. Thereafter, an etching process is performed to remove a portion of the spacer material layer so that spacers are formed on the respective sidewalls of the gate structure. After that, a plasma treatment step is performed to form a spacer protection layer on the surface of the substrate, the spacers and the gate structure.

Abstract: A method of fabricating spacers is provided. The method includes providing a substrate with a device structure formed thereon. The device structure comprises a gate structure and a pair of source/drain regions. Then, a spacer material layer is formed over the substrate to cover the substrate and the device structure. Thereafter, an etching process is performed to remove a portion of the spacer material layer so that spacers are formed on the respective sidewalls of the gate structure. After that, a plasma treatment step is performed to form a spacer protection layer on the surface of the substrate, the spacers and the gate structure.