Patents by Inventor Chuan-Kang Mu

Chuan-Kang Mu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7114941
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 3, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu
  • Patent number: 7046441
    Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 16, 2006
    Assignee: Industrial Technology Research Institute
    Inventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
  • Publication number: 20050141090
    Abstract: The present invention relates to a high-transmission polarization module composed of sub-wavelength structures, which comprises: a transmission substrate and a plurality of collimation units. The transmission substrate possesses a top and a bottom surfaces. The top surface has a plurality of projecting and sunken parts, wherein the sunken part has a first sub-wavelength structure while the projecting part has a second sub-wavelength structure. The collimation units are arranged on the bottom surface according to the positions of the sunken parts capable of guiding the light into the sunken part. The first sub-wavelength structure is capable of separating the light with different polarizations while the second sub-wavelength structure is capable of shifting the phase of the light so that the light can pass the polarization module with a high efficiency and producing a light with a specific polarization.
    Type: Application
    Filed: March 31, 2004
    Publication date: June 30, 2005
    Inventors: Heng-Chun Huang, Jauh-Jung Yang, Jung-Yan Huang, Ming-Yueh Liu, Chuan-Kang Mu
  • Publication number: 20040119199
    Abstract: A hot embossing auto-leveling apparatus which has an air-floating spherical bearing between a lower mold and a base, placed in a depression on the base, with the base housing an air inlet and an air outlet. A hot embossing auto-leveling method, comprising the steps of (1) performing an upward and downward coupling movement of the lower and upper molds; (2) adjusting the lower mold against the upper mold using the air-floating spherical bearing; (3) fixing the lower mold by under pressure in an orientation parallel to the upper mold; (4) placing a molded part on the lower mold; (5) evacuating, heating and pressurizing a working chamber; (6) cooling; and (7) opening.
    Type: Application
    Filed: March 20, 2003
    Publication date: June 24, 2004
    Inventors: Jung Yan Huang, Chu Shu Tsai, Choung-Lii Chao, Chuan Kang Mu, Jauh Jung Yang, Cheng-Chun Huang, Ming Yueh Liu
  • Patent number: 6584250
    Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: June 24, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang
  • Publication number: 20020114578
    Abstract: An optical fiber alignment element using integrated micro ball lens includes a substrate and a plurality of V-shaped grooves or waveguides formed on the substrate by lithography and etching. The substrate surface is coated with a first polymer layer and a high transparency second polymer layer, then is processed through a lithography process and heating process to form at least a base pad and a spherical micro ball lens between the V-shaped grooves or waveguides. Then dispose optical fibers in the V-shaped grooves. And encase an upper cap over the micro ball lens, grooves, and optical fibers or waveguides. Through suitable configuration and positioning of the micro ball lens, grooves or waveguides, the micro ball lens may be aligned precisely between two sides of the optical fibers or waveguides. The process is simpler, more accurate, and may produce the optical fiber alignment element in an integrated and batch fashion.
    Type: Application
    Filed: February 20, 2001
    Publication date: August 22, 2002
    Inventors: Yuh-Sheng Lin, Cheng-Chun Huang, Ming-Yueh Liu, Jauh-Jung Yang, Chuan-Kang Mu, Ya-Ru Huang
  • Patent number: 6309488
    Abstract: A manufacturing method for a high precision mold comprises the steps of (a) placing a plastic body on a conductor substrate, (b) forming a plurality of perforating apertures in the plastic body using X-ray deep etching molding, (c) rounding the edges at the front end of the perforating apertures using ultraviolet (UV) lithography, and (d) electroforming the high precision mold using the plastic body with perforating apertures as a model. A fiber connector sleeve can be further manufactured by (e) molding a fiber aligning element using the high precision mold, (f) molding a fiber sleeve body using an usual mold, and (g) combining the fiber aligning element with the fiber sleeve body using ultrasonic waves to form the fiber connector sleeve.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: October 30, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hsi-Harng Yang, Shih-Chou Chen, Chuan-Kang Mu, Jauh-Jung Yang
  • Patent number: 6251565
    Abstract: A method of making molds for use in manufacturing high precision and high density multiple-lead microstructures. If employs microphoto etching process used in semiconductor manufacturing process to project X-ray and ultraviolet light on a photoresist layer through a X-ray co-mask and a generally used mask to produce exposing process. Through etching and electroplating processes, a plurality of identical punch molds may be made. The punch molds are aligned stacked up one upon the other until a desired height is reached. The stacked up punch molds are electroplated to form a lead punch die for producing microparts desired.
    Type: Grant
    Filed: August 16, 1999
    Date of Patent: June 26, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Hsi-Harng Yang, Min-Chieh Chou, Cheng-Tang Pan, Chuan-Kang Mu