Patents by Inventor Chuan Keat LOW

Chuan Keat LOW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Affinity bond layer
    Patent number: 8888944
    Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: November 18, 2014
    Inventors: Erik G. De Jong, Michael K. Pilliod, Chuan Keat Low, James R. Krogdahl, Rimple Bhatia, Justin T. Sawyer, Michael B. Wittenberg
  • AFFINITY BOND LAYER
    Publication number: 20140071597
    Abstract: A method and apparatus for bonding a first substrate to a second substrate can include an intermediate layer disposed between the substrates. In one embodiment, the intermediate layer can be disposed to a bonding area of the first substrate and only one adhesive layer can be disposed between the intermediate layer and the second substrate. In other embodiments, a plurality of intermediate layers can be used.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Erik G. DE JONG, Michael K. PILLIOD, Chuan Keat LOW, James R. KROGDAHL, Rimple BHATIA, Justin T. SAWYER, Michael B. WITTENBERG
  • LASER ABLATION ADHESION PROMOTION
    Publication number: 20140071595
    Abstract: A method for bonding two substrates can use a laser to ablate a bonding surface of at least one of the two substrates. In one embodiment, the laser can be used to produce a predetermined average surface roughness in a bonding surface region of one of the substrates. In another embodiment, the substrate can comprise a resin filled polymer. Ablating the surface of the bonding surface can increase the bond strength in the ablation region.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 13, 2014
    Applicant: Apple Inc.
    Inventors: Erik G. DE JONG, Michael K. PILLIOD, Chuan Keat LOW, James R. KROGDAHL, Rimple BHATIA