Patents by Inventor Chuan Kiak Ng

Chuan Kiak Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and leadframe therefor having angled corners
    Patent number: 7247931
    Abstract: A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
    Type: Grant
    Filed: July 24, 2006
    Date of Patent: July 24, 2007
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Chuan Kiak Ng, Ein Sun Ng, Yeu Wen Lee
  • Method for making a direct chip attach device and structure
    Patent number: 7144538
    Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: December 5, 2006
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Yeu Wen Lee, Chuan Kiak Ng, Guan Keng Quah
  • Method of forming a leadframe for a semiconductor package
    Patent number: 7105378
    Abstract: A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: September 12, 2006
    Assignee: Semiconductor Components Industries, LLC
    Inventors: Chuan Kiak Ng, Ein Sun Ng, Yeu Wen Lee
  • Method for making a direct chip attach device and structure
    Publication number: 20040262811
    Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Applicant: Semiconductor Components Industries, LLC
    Inventors: Yeu Wen Lee, Chuan Kiak Ng, Guan Keng Quah