Patents by Inventor Chuan-Li Cheng

Chuan-Li Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite insulating layer and manufacturing method thereof
    Patent number: 8801908
    Abstract: A composite insulating layer and a manufacturing method thereof. The composite insulating layer includes a socket substrate, a connection layer disposed on the socket substrate, a conductive metal layer disposed on the connection layer, an insulating metal layer disposed on the conductive metal layer, an insulating ceramic layer disposed on the insulating metal layer, and a electrodeposition layer disposed on the insulating ceramic layer. The composite insulating layer of the present invention can avoid the electromagnetic interference generated from the pins of the CPU and increase the stability of the CPU.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: August 12, 2014
    Assignee: Chenming Mold Ind. Corp.
    Inventors: Chuan-Li Cheng, Chao-Lun Liu, Chih-Feng Hsu
  • Integrated Circuit Shielding Film and Manufacturing Method Thereof
    Publication number: 20130193566
    Abstract: An integrated circuit shielding film and a manufacturing method thereof. The manufacturing method provides a plate. A stripping glue is coated on the plate. An integrated circuit is disposed on the stripping glue and the stripping glue is deposited on the surface of the integrated circuit. A shielding film is then formed on the integrated circuit by coating operations.
    Type: Application
    Filed: September 12, 2012
    Publication date: August 1, 2013
    Applicant: CHENMING MOLD IND. CORP.
    Inventors: Chuan-Li Cheng, Hsueh-Tsu Chang
  • Composite Insulating Layer and Manufacturing Method Thereof
    Publication number: 20130171464
    Abstract: A composite insulating layer and a manufacturing method thereof. The composite insulating layer includes a socket substrate, a connection layer disposed on the socket substrate, a conductive metal layer disposed on the connection layer, an insulating metal layer disposed on the conductive metal layer, an insulating ceramic layer disposed on the insulating metal layer, and a electrodeposition layer disposed on the insulating ceramic layer. The composite insulating layer of the present invention can avoid the electromagnetic interference generated from the pins of the CPU and increase the stability of the CPU.
    Type: Application
    Filed: June 15, 2012
    Publication date: July 4, 2013
    Applicant: CHENMING MOLD IND. CORP.
    Inventors: Chuan-Li Cheng, Chao-Lun Liu, Chih-Feng Hsu
  • Coating Method and Structure Thereof
    Publication number: 20110293947
    Abstract: The present invention discloses a coating method and a structure thereof applicable to absorb the heat radiation and heat dissipation. The method comprises the steps of: providing a metal material and an insulating material; melting the metal material and the insulating material; atomizing and spraying the metal material on a substrate at least a predetermined thickness; disposing the insulating material on the metal material.
    Type: Application
    Filed: July 26, 2010
    Publication date: December 1, 2011
    Applicant: Chenming Mold Ind. Corp.
    Inventors: Chuan-Li Cheng, Li-Wei Lin