Abstract: A method for updating firmware is provided. The method includes: obtaining an AP firmware update file and a SP firmware update file set by the AP, the AP firmware update file and the SP firmware update file set are obtained by parsing a same system firmware update file that has been released, and the SP firmware update file set supports multiple different models of the SP; updating, by the AP, a system firmware of the AP according to the AP firmware update file, and sending a target firmware update file parsed from the SP firmware update file set to the SP; the target firmware update file supports the models of the SP; updating, by the SP, a system firmware of the SP according to the target firmware update file. According to the present application, a unified management of firmware versions is facilitated.

Abstract: A method for operating a second system application in a first system is provided The method includes: creating an operating environment of the second system application through a loader on a target terminal; generating an application function component of the second system application in the loader; compiling script files of the second system application into dynamic library files by utilizing the compiling environment supported by the target terminal, and encapsulating the dynamic library files into an application package; installing the application package through the loader, and operating the dynamic library files in the application package under the operating environment. According to the aforesaid method, target terminal can directly respond to a system instruction generated during execution of the compiled dynamic library files without the need of parsing and converting the system instruction, thus, a cross-platform operation efficiency of the application program can be improved.

Abstract: A semiconductor device package includes a die, a molding layer, a heat spreader lid, and a warpage control adhesive layer. The molding layer surrounds the die. The molding layer has a first edge and a second edge at least partially defining a corner of the molding layer. The heat spreader lid covers the molding layer and the die. The warpage control adhesive layer is between the heat spreader lid and the molding layer. The warpage control adhesive layer is at the corner of the molding layer and has a bar shape in a top view, and the warpage control adhesive layer extends from the first edge toward the second edge of the molding layer.

Abstract: Techniques for server-based UI rendering are described. In an example, a system receives, from a device, a request associated with rendering a UI that includes multiple UI components. The system receives, from a first source associated with a first UI component, availability information indicating that the first UI component is available for use by other UI components. Based at least in part on the availability information, the system determines that the first UI component is available for use by a second UI component. The system receives, from a second source associated with the second UI component, event information indicating content presentable in the first UI component and an event trigger at the second UI component to present the content. Further, the system sends, to the device, a set of instructions associated with the rendering of the UI. The set of instructions includes the event information.

Abstract: Embodiments of this application disclose a route advertisement method, a route loop check method, and a device, so as to resolve a route loop problem in a network, and improve reliability of service packet transmission. The route advertisement method includes the following steps: A first network device receives a first route advertisement message, where a first field of the first route advertisement message includes a device identifier, and routing information included in the first route advertisement message comes from a device corresponding to the device identifier. The first network device generates a second route advertisement message based on the first route advertisement message, where a second field of the second route advertisement message includes the device identifier, and the first field and the second field are different fields. The first network device sends the second route advertisement message to a second network device.

Abstract: The invention relates to a precipitation-strengthened shape memory alloy (SMA) comprising a composition designed and processed such that the precipitation-strengthened SMA meets property objectives comprising a yield strength being more than about 1500 MPa at room temperature, a transformation temperature in a range of about ?15 to 20° C., a misfit in a range of about 0.9-1.1%, wherein the property objectives are design specifications of the precipitation-strengthened SMA.

Abstract: The present disclosure relates to systems and methods for determining abnormal information associated with a vehicle. The systems may perform the methods to obtain real-time information associated with a bicycle and obtain reference information associated with the bicycle. The systems may also perform the methods to determine, based on the real-time information and the reference information, abnormal information associated with the bicycle, and transmit the abnormal information associated with the bicycle.

Abstract: Disclosed are a method for implementing multiple PDNs between an indoor unit and an outdoor unit, an outdoor unit, an indoor unit, and a computer readable storage medium. The method may include: allocating at least two first VLAN interfaces to a first physical network interface; establishing packet data network (PDN) data channels which are in one-to-one correspondence with the first VLAN interfaces, wherein the PDN data channels are configured for data interaction with a base station; acquiring address allocation requests corresponding to the PDN data channels from the IDU; and allocating first IP addresses corresponding to the PDN data channels to the IDU according to the address allocation requests, such that data messages from the IDU are routed to the corresponding PDN data channels according to the first IP addresses.

Abstract: The invention provides a display device and a method of manufacturing a thin film transistor. The method of manufacturing a thin film transistor comprises: (A) providing a substrate; (B) forming a light shielding layer on the substrate, and patterning the light shielding layer to form a patterned light shielding layer; (C) forming a buffer layer on the substrate; (D) forming a semiconductor layer on the substrate, and patterning the semiconductor layer to form a patterned semiconductor layer; (E) forming an insulating layer on the substrate; and (F) forming a conductive layer on the substrate, and patterning the conductive layer to form a patterned conductive layer; wherein the same mask is used for patterning the light shielding layer and the semiconductor layer. Photoelectric effect of the thin film transistor outside the display region can be effectively avoided, while reducing the number of masks in the production process.

Abstract: The present invention is a device for simulating lower jaw activity. The device can be utilized in cooperation with an artificial intelligent lower jaw occlusion and attitude recording device. The device comprises a base, an upper jaw tooth mold, an opening and closing rotating platform, a left and right rotating platform, a horizontal rotating platform, a front-back shifting platform and a lower jaw tooth mold. The present invention makes it possible to make lower jaw moving forward and backward, opening and closing (pitch), tilting left and right (yaw), in place rotating (yaw), and etc. Then, according to the data obtained by the artificial intelligent lower jaw occlusion and attitude recording device, the lower jaw activities concluded through the reverse engineering by means of the present invention facilitates production of accurate intra-oral device, and can be applied to unknown complex actions in dental medical research, such as occlusion, bruxism, swallowing, sounding, and etc.

Abstract: A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.