Patents by Inventor Chuan-Mao Wei

Chuan-Mao Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anisotropic conductive film bonding pad
    Patent number: 7038327
    Abstract: Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: May 2, 2006
    Assignee: AU Optronics Corp.
    Inventors: Sheng-Hsiung Ho, Chuan-Mao Wei, Ke-Feng Lin
  • Anisotropic conductive film bonding pad
    Publication number: 20050098902
    Abstract: Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.
    Type: Application
    Filed: February 26, 2004
    Publication date: May 12, 2005
    Inventors: Sheng-Hsiung Ho, Chuan-Mao Wei, Ke-Feng Lin