Abstract: A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

Abstract: An electronic device includes a first metal layer, a first insulating layer, a second metal layer, a second insulating layer, a third metal layer, a third insulating layer, a fourth metal layer, a fourth insulating layer and a conductive structure. The first insulating layer is disposed on the first metal layer. The second metal layer is disposed on the first insulating layer. The second insulating layer is disposed on the second metal layer. The third metal layer is disposed on the second insulating layer. The third insulating layer is disposed on the third metal layer. The fourth metal layer is disposed on the third insulating layer. The fourth insulating layer is disposed on the fourth metal layer. The conductive structure is disposed on and electrically connected to the fourth insulating layer. A chemical resistance of the first insulating layer is greater than a chemical resistance of the fourth insulating layer.

Abstract: A redistribution layer structure and the manufacturing method thereof are provided. The redistribution layer structure includes a first metal layer, a first dielectric layer, a second metal layer, and a second dielectric layer. The first dielectric layer is disposed on the first metal layer. The second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the second metal layer. A chemical resistance of the first dielectric layer is greater than a chemical resistance of the second dielectric layer.

Abstract: A method of manufacturing an electronic device includes providing a substrate, providing an intermediate layer on the substrate, and providing an isolation layer on the intermediate layer. The substrate includes an active region and a peripheral region. The peripheral region is adjacent to the active region, and the ratio of the area of the active region to the area of the substrate surface is between 75% and 92%. The isolation layer includes a first surface and at least one slope. The first surface of the isolation layer is correspondingly disposed in the active region. The at least one slope of the isolation layer is correspondingly disposed in the peripheral region and at a first angle with respect to the substrate surface.

Abstract: The embodiment of the disclosure provides a composite layer circuit element of an electronic device. The composite layer circuit element includes a first dielectric layer, a first circuit layer and a second dielectric layer. The first circuit layer is disposed on the first dielectric layer, and the second dielectric layer is disposed on the first circuit layer. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer in a cross section view.

Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.

Abstract: A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.

Abstract: A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.

Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.

Abstract: A redistribution layer structure and the manufacturing method thereof are provided. The redistribution layer structure includes a first metal layer, a first dielectric layer, a second metal layer, and a second dielectric layer. The first dielectric layer is disposed on the first metal layer. The second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the second metal layer. A chemical resistance of the first dielectric layer is greater than a chemical resistance of the second dielectric layer.

Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.

Abstract: The invention relates to a detective molecule, and more particularly to a detective molecule and a kit for detecting a target molecule, a method for predicting fragrance production in an orchid, and a method for breeding a scented orchid.

Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.

Abstract: The invention relates to a detective molecule, and more particularly to a detective molecule and a kit for detecting a target molecule, a method for predicting fragrance production in an orchid, and a method for breeding a scented orchid.

Abstract: A folding stroller comprises a stroller frame and a foldable and detachable seat (4), the stroller frame (10) having a supporting rack (14) for providing a first engaging site (2) and a second engaging site (3). The foldable and detachable seat (4) can connect to the stroller frame (10) at the first engaging site (2) and the second engaging site (3), and can be released from the first engaging site (2) by folding its seat back (42), and thereafter disengaging from the second engaging site (3) by pulling a releasing member (64).

Abstract: A joint structure with a stable unlocked state for a foldable playpen, comprising a pair of upper rails, a rigid shroud, a pair of lock pins, a pair of spring biased pin-carriers, and a release actuator. The pair of upper rails each have a necked portion and a pushing element; the rigid shroud is pivotally connected between the pair of upper rails; the pair of spring biased pin-carriers is installed within the rigid shroud for carrying the pair of lock pins to engage with the necked portion, thereby locking the pair of upper rails in a use position and to leave the necked portion to release the pair of upper rails from the use position. The pair of spring biased pin-carriers are featuring with a side extension flap for abutting against the pushing element, and an associating short arm for keeping the pair of spring biased pin-carriers to rotate in an opposite directions simultaneously.

Abstract: A joint assembly with safety locking mechanisms for baby stroller, the baby stroller frame may have at least a front strut, a rear strut and an upper bar; and the joint assembly includes a lower joint member, an upper joint member, a first locking mechanism, a second locking mechanism and a release mechanism. The lower joint member is pivotally connected with the upper end of the front strut and pivots with the rear strut through a pivot mount atop the rear strut. The upper joint member pivots with the lower joint member and connects with the lower end of the upper bar. The first locking mechanism is adapted to releasably lock the lower joint member to the upper joint member thereby to inhibit the potential relative rotation between the lower joint member and the upper joint member. The second locking mechanism is adapted to releasably lock the rear strut to the joint assembly thereby to inhibit the potential relative rotation between the rear strut and the joint assembly.

Abstract: A brake mechanism for a baby stroller, having a plurality of wheels and a pair of rotatable push arms capable of being moved either forward or rearward. The brake mechanism comprises a connecting assembly and an actuator; and has a braking block for operatively stopping the baby stroller. The connecting assembly has a pulling slider for operatively associating with the braking block of the brake mechanism, and the actuator is operatively secured to the push arm and associated with the connecting assembly, so as to indirectly drive the brake mechanism. This allows a user to manipulate the actuator to stop the stroller from either in front of or behind the stroller.

Abstract: A folding stroller comprises a stroller frame and a foldable and detachable seat (4), the stroller frame (10) having a supporting rack (14) for providing a first engaging site (2) and a second engaging site (3). The foldable and detachable seat (4) can connect to the stroller frame (10) at the first engaging site (2) and the second engaging site (3), and can be released from the first engaging site (2) by folding its seat back (42), and thereafter disengaging from the second engaging site (3) by pulling a releasing member (64).