Abstract: A process for manufacturing semiconductor devices is carried out using an apparatus comprising a conversion mechanism having a drive shaft (11), a first rod (12) connected to the drive shaft (11), and a second rod (13) connecting the second rod (12) to a third rod (14) which is guided by means of a linear bearing (16, 17). The mechanism has a lever (21) extending substantially in a transverse direction (x) perpendicular to a stamping direction (z). The third rod (14) is coupled to the lever (21) via a first coupling, in this case a fourth rod (33) which is coupled at a first end to the third rod (14) via a rotary coupling (31) and is coupled to the lever (21) via a rotary coupling (32). The lever (21) is further coupled to the chassis (50) via a second coupling (40) and is coupled to a plunger (71) via a third coupling (60).