Patents by Inventor Chuan Sun
Chuan Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11972537Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.Type: GrantFiled: August 19, 2022Date of Patent: April 30, 2024Assignee: YU JUNG CHANG TECHNOLOGY CO., LTD.Inventors: Chih-Chuan Chen, Wei-Hsiang Tsai, Chin-Yu Chen, Ching-Cherng Sun, Jann-Long Chern, Yu-Kai Lin
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Publication number: 20240136420Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.Type: ApplicationFiled: December 1, 2022Publication date: April 25, 2024Applicant: AUO CorporationInventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
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Patent number: 11964851Abstract: An overhead hoist transfer (OHT) apparatus and a differential overhead trolley thereof are provided. The OHT apparatus includes a rail module and a differential overhead trolley. The rail module includes a main rail and a first rail, and defines a turning path extending from the main rail to the first rail. The differential overhead trolley is movably disposed on the rail module, and includes a walking mechanism and a carrying body that is hung on the rail module by being connected to the walking mechanism. The walking mechanism includes two differential wheels and a driving unit that is connected to the two differential wheels. When the differential overhead trolley is moved along the turning path, the driving unit is configured to drive the two differential wheels to move along the first rail by different rolling velocities.Type: GrantFiled: November 6, 2020Date of Patent: April 23, 2024Assignee: MIRLE AUTOMATION CORPORATIONInventors: Houng Sun, Cheng-Cheng Lo, Chuan-Ming Chung
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Publication number: 20240128642Abstract: An antenna module and an electronic device are provided. The antenna module is disposed in a housing of the electronic device. The antenna module includes a first radiating element, a second radiating element, a grounding element, and a switching circuit. The first radiating element includes a first radiating portion and a second radiating portion that are connected with each other. The second radiating element includes a third radiating portion, a fourth radiating portion, a fifth radiating portion, and a feeding portion. The switching circuit is electrically connected between the grounding element and the first radiating element or between the grounding element and the feeding portion.Type: ApplicationFiled: March 24, 2023Publication date: April 18, 2024Inventors: TZU-KUAN SUN, PAO-CHUAN PENG, MENG-KAI WU, HONG-JUN JIAN
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Publication number: 20240112157Abstract: A network-based computing system can implement a transaction service in which digital wallets of client transaction entities are dynamically monitored to maintain a balance within a liquidity tranche unique to each transaction entity. The computing system can further execute a smart liquidity model that parses transaction requests into smaller clips and execution timing intervals such that risk of transaction failure is minimized or eliminated.Type: ApplicationFiled: October 3, 2023Publication date: April 4, 2024Inventors: Chuan Sun, Hope Chapman, Piali Das, Jon Wedrogowski, Laurel Ruhlen, Yujia Huo, Bradley Chase
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Publication number: 20240112156Abstract: A network-based computing system can implement a transaction service in which digital wallets of client transaction entities are dynamically monitored to maintain a balance within a liquidity tranche unique to each transaction entity. The computing system can further execute a smart liquidity model that parses transaction requests into smaller clips and execution timing intervals such that risk of transaction failure is minimized or eliminated.Type: ApplicationFiled: October 3, 2023Publication date: April 4, 2024Inventors: Chuan Sun, Hope Chapman, Piali Das, Jon Wedrogowski, Laurel Ruhlen, Yujia Huo, Bradley Chase
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Patent number: 11937734Abstract: A refrigerator includes a water dispensing device, and the water dispensing device includes a water tank, a drain pipeline, a beverage making chamber, in which a capsule support for receiving a beverage powder capsule and a capsule piercer for puncturing the capsule operatively are provided; and a dispenser, communicated with an outlet of the beverage making chamber, including a beverage outlet of which the prepared beverage flows out. The refrigerator has a water dispensing device capable of making a beverage, such as coffee, milk tea, or the like, based on demands from a user, thereby satisfying diverse drinking demands from people and solving problem of a single function of an existing refrigerator.Type: GrantFiled: October 12, 2018Date of Patent: March 26, 2024Assignee: QINGDAO HAIER JOINT STOCK CO., LTD.Inventors: Lihua Zuo, Yanqing Zhang, Weishou Sun, Jianjun Xue, Chuan Cui
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Publication number: 20240096855Abstract: A method of wafer-level manufacturing of an optical package (285) is disclosed. The method comprises forming an apertured substrate (170; 405) by a process of vacuum injection molding, each aperture (175A; 175B) in the apertured substrate configured to support an optical element (225; 420; 425). The method also comprises coupling the apertured substrate to a further substrate (255) comprising optical devices (260, 265) aligned with the apertures in the apertured substrate. Also disclosed is optical package (285, 600) formed according to the method and an apparatus, such as a smartphone, comprising the optical package.Type: ApplicationFiled: December 8, 2021Publication date: March 21, 2024Applicant: ams-OSRAM Asia Pacific Pte. Ltd.Inventors: Zhen Kai NAM, Qi Chuan YU, Kam Wah LEONG, Yeu Woon CHAN, Royce VIRINTHORN, Sundar Raman GNANA SAMBANDAM, Zhang Xin SUN
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Patent number: 11796155Abstract: There are provided a backlight assembly (1) and a display device, the backlight assembly (1) includes a light source substrate (10), a microstructure film layer (30) and a backlight film material layer (20); the backlight film material layer (20) is located on a light outgoing side of the light source substrate (10), the microstructure film layer (30) is provided between the light source substrate (10) and the backlight film material layer (20), the microstructure film layer (30) includes a light transmission layer (301) and a microstructure region (302); the microstructure region (302) is provided at an edge position of the microstructure film layer (30).Type: GrantFiled: May 20, 2021Date of Patent: October 24, 2023Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Jianfeng Yao, Qiuli Wang, Lei Chen, Zhiqiang Wang, Xin Ma, Chuan Sun, Xinyu Wang, Dingyang Tan
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Publication number: 20230332134Abstract: Provided is an automated system for preparing purified plasmid DNA in commercial scale.Type: ApplicationFiled: August 17, 2021Publication date: October 19, 2023Applicants: Nanjing GenScript Biotech Co., Ltd., GenScript USA Inc.Inventors: Stephen Richard Hughes, Xiaoli Fu, Yifan Li, Yuzhuo He, Hong Li, Cheng-Hsien Wu, Chuan Sun
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Patent number: 11774468Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.Type: GrantFiled: July 6, 2022Date of Patent: October 3, 2023Assignee: MPI CORPORATIONInventors: Chin-Tien Yang, Yang-Hung Cheng, Yu-Hao Chen, Chin-Yi Tsai, Hui-Pin Yang, Horng-Chuan Sun
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Patent number: 11762235Abstract: A backlight module and a display device are disclosed. The backlight module includes a light emitting element array including a plurality of light emitting elements that emit blue light; a quantum dot film disposed on a light-emergent side of the light emitting element array and having a middle area and an edge area, the edge area surrounding the middle area; and a light conversion layer disposed on the light-emergent side of the light emitting element array, wherein an orthographic projection of the light conversion layer on the quantum dot film is located in the edge area of the quantum dot film, a material of the light conversion layer includes a first light conversion material configured to emit red light under excitation of light from the light emitting element and a second light conversion material configured to emit green light under excitation of light from the light emitting element.Type: GrantFiled: March 30, 2020Date of Patent: September 19, 2023Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Zhiqiang Wang, Fangyu Song, Xin Ma, Qiuli Wang, Jianfeng Yao, Chuan Sun
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Patent number: 11732970Abstract: The present disclosure generally relates to a heat exchanger (50) and a heat exchange unit (100) for the heat exchanger (50). The heat exchange unit (100) comprises: a plurality of plain fins (102) stacked perpendicularly to a first plane, such that a first fluid (104) is communicable through the first plane between the fins (102); and a plurality of tubes (112) for communicating a second fluid (110) therethrough for heat exchange with the first fluid (104), the tubes (112) extending perpendicularly through the fins (102), each tube (112) comprising an oblique cross-section (114) having a pair of opposing first sides (114a) and a pair of opposing second sides (114b). For each oblique cross-section (114), the first sides (114a) are perpendicular to the first plane and the second sides (114b) are angled approximately 60° to the first plane, the first sides (114a) being longer than the second sides (114b).Type: GrantFiled: June 27, 2019Date of Patent: August 22, 2023Assignee: National University of SingaporeInventors: Poh Seng Lee, Nuttawut Lewpiriyawong, Chuan Sun, Kent Loong Khoo
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Patent number: 11635656Abstract: The present disclosure discloses a backlight module and a display apparatus. A microprism film layer is further arranged on a light emitting side of a light guide plate, and the microprism film layer is located in a range of a preset distance by which the light guide plate extends from a side close to a light source to a side away from the light source; and the microprism film layer includes a plurality of first microprism structures, and the first microprism structures are configured to make an incident angle of light at a first interface when entering the first microprism structures greater than an emitting angle of the light at the first interface when exiting from the first microprism structures when the light in the light guide plate enters the first microprism structures from the light guide plate and then enters the light guide plate from the first microprism structures.Type: GrantFiled: June 10, 2021Date of Patent: April 25, 2023Assignee: BOE TECHNOLOGY GROUP CO., LTD.Inventors: Qiuli Wang, Lei Chen, Zhiqiang Wang, Xin Ma, Chuan Sun, Jianfeng Yao, Xinyu Wang, Dingyang Tan
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Patent number: 11620932Abstract: A displaying device and a driving method thereof, wherein the displaying device includes a first display panel, a second display panel and a driving circuit; the first display panel includes a plurality of first pixel units that are able to display a color, wherein each of the first pixel units includes a plurality of sub-pixel units; and the second display panel is provided on a light exiting side of the first display panel, including a plurality of second pixel units; wherein a distribution density of the plurality of second pixel units is greater than a distribution density of the plurality of sub-pixel units.Type: GrantFiled: March 16, 2021Date of Patent: April 4, 2023Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Zhiqiang Wang, Lin Xu, Xin Ma, Qiuli Wang, Chuan Sun, Jianfeng Yao, Dingyang Tan, Xinyu Wang
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Publication number: 20230007997Abstract: A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.Type: ApplicationFiled: July 6, 2022Publication date: January 12, 2023Applicant: MPI CORPORATIONInventors: CHIN-TIEN YANG, YANG-HUNG CHENG, YU-HAO CHEN, CHIN-YI TSAI, HUI-PIN YANG, HORNG-CHUAN SUN
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Publication number: 20220406352Abstract: A memory device with a three-dimensional (3D) staircase memory stack includes dummy connectors proximate semi-isolated connectors. The memory device includes multiple wordlines stacked in a 3D staircase stack, which includes a wordline at an edge of a region of the staircase. The memory device includes vertical connectors through an isolation layer on the 3D staircase stack to connect the wordlines with conductive lines in an access layer. A wordline at the edge of the region of the staircase has a vertical connector that will be adjacent a connector on one side and not on the other side. The memory device includes at least one dummy vertical connector on the edge side of the vertical connector of the wordline on the edge, wherein the dummy vertical connector does not electrically connect a wordline of the 3D staircase stack to a conductive line in the access layer.Type: ApplicationFiled: December 12, 2019Publication date: December 22, 2022Inventors: Liu LIU, Chuan SUN, Hong MA
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Publication number: 20220373161Abstract: There are provided a backlight assembly (1) and a display device, the backlight assembly (1) includes a light source substrate (10), a microstructure film layer (30) and a backlight film material layer (20); the backlight film material layer (20) is located on a light outgoing side of the light source substrate (10), the microstructure film layer (30) is provided between the light source substrate (10) and the backlight film material layer (20), the microstructure film layer (30) includes a light transmission layer (301) and a microstructure region (302); the microstructure region (302) is provided at an edge position of the microstructure film layer (30).Type: ApplicationFiled: May 20, 2021Publication date: November 24, 2022Inventors: Jianfeng YAO, Qiuli WANG, Lei CHEN, Zhiqiang WANG, Xin MA, Chuan SUN, Xinyu WANG, Dingyang TAN
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Patent number: 11402716Abstract: A visual range adjustment component and a driving method thereof, a visual range adjustment device, and a display device are disclosed. The visual range adjustment component includes a first substrate; a second substrate; an electrolyte layer; and a plurality of electrochromic elements. Each of the plurality of electrochromic elements includes a first transparent electrode, two second transparent electrodes and an electrochromic layer; the first transparent electrode is located on a side of the first substrate facing the second substrate and the second transparent electrode is located on a side of the second substrate facing the first substrate; the electrolyte layer is arranged to be in contact with the first transparent electrode, the second transparent electrode, and the electrochromic layer, respectively; the first transparent electrode and the two second transparent electrodes respectively drive the electrochromic layer to change color through the electrolyte layer to adjust a visual range.Type: GrantFiled: December 7, 2018Date of Patent: August 2, 2022Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Lei Chen, Qi Zhang, Xuerong Wang, Zhiqiang Wang, Xin Ma, Chuan Sun, Qiuli Wang, Bochao Rui, Lingyun Shi, Hao Zhang
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Publication number: 20220148971Abstract: Etch stops are disclosed for integrated circuit applications that have a set contacts of varying height, wherein there is a large height differential between the shortest and tallest contacts. In one example, an etch stop is provisioned over a 3D NAND memory staircase structure. The structure is then planarized with an insulator material that can be selectively etched with respect to the etch stop. Contact holes that land on corresponding wordlines of the staircase are etched. Due to the nature of the staircase, the holes vary in depth depending on which step of the staircase they land. The etch stop under the shallowest hole remains intact while the deepest hole is etched to completion. Once all holes have landed on the etch stop, a further etch selective to the insulator material is carried out to punch through the etch stop and expose underlying wordlines. Contacts are deposited into the holes.Type: ApplicationFiled: May 9, 2019Publication date: May 12, 2022Inventors: Daniel R. LAMBORN, Chuan SUN, Qi ZHOU