Abstract: A display panel structure and a manufacturing method thereof are disclosed. The display panel structure comprises a first substrate, a second substrate, at least a liquid crystal display (LCD) array, a plurality of LCD units, a plurality of first sealants and at least a second sealant. The second substrate is disposed corresponding to the first substrate. The LCD array is disposed between the first substrate and the second substrate. The LCD units are disposed within the LCD array. The first sealants are disposed around the LCD units, respectively. The second sealant is disposed around the LCD array in annulus. Thereby, the problems of the substrate peeling and fragment occurring in the process of the dorsal plating forming a conducting layer can be improved, and besides, the internal strike effect of the liquid crystal can be restrained, so as to enhance the technical yield.

Abstract: A manufacturing method of a display panel structure comprises steps of: disposing a plurality of first sealants around a plurality of LCD units on a first substrate, respectively, to form at least an LCD array; forming at least a second sealant on the first substrate, so that the second sealant is disposed on the outside of the LCD array in a multi-segment manner; and attaching a second substrate and the first substrate to each other, so that the second sealant connects the first substrate and the second substrate. Thereby, the problems of the substrate peeling and fragment occurring in the process of the dorsal plating forming a conducting layer can be improved, and besides, the internal strike effect of the liquid crystal can be restrained, so as to enhance the technical yield.

Abstract: A display panel structure comprises a first substrate, a second substrate, at least an array, a plurality of liquid crystal display (LCD) units, a plurality of first sealants and at least a second sealant. The second substrate is disposed corresponding to the first substrate. The array is disposed between the first substrate and the second substrate. The LCD units are disposed within the array. The first sealants are disposed on the outside of the LCD units, respectively. The second sealant is disposed on the outside of the array in a multi-segment manner. Thereby, the problems of the substrate peeling and fragment occurring in the process of the dorsal plating to form a conducting layer can be improved, and the internal strike effect of the liquid crystal can be restrained, so as to enhance the technical yield.