Abstract: The present invention discloses a micro-electro-mechanical system (MEMS) device, comprising: a mass including a main body and two capacitor plates located at the two sides of the main body and connected with the main body, the two capacitor plates being at different elevation levels; an upper electrode located above one of the two capacitor plates, forming one capacitor therewith; and a lower electrode located below the other of the two capacitor plates, forming another capacitor therewith, wherein the upper and lower electrodes are misaligned with each other in a horizontal direction.

Abstract: The present invention discloses a method for making a MEMS device, comprising: providing a zero-layer substrate; forming a MEMS device region on the substrate, wherein the MEMS device region is provided with a first sacrificial region to separate a suspension structure of the MEMS device from another part of the MEMS device; removing the first sacrificial region by etching; and micromachining the zero-layer substrate.

Abstract: According to the present invention, an in-plane sensor comprises a structure unit which includes: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end; and a movable structure including at least one proof mass which surrounds the fixed finger in a horizontal plane.

Abstract: According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.

Abstract: According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order; and a protrusion connected under the thin film structure. A preferred thin film structure includes at least a lower protection layer, a metal layer and an upper protection layer. The MEMS device for example is a capacitive MEMS acoustical sensor.

Abstract: According to the present invention, a method for making a micro-electro-mechanical system (MEMS) device comprises: providing a substrate with devices and interconnection formed thereon, the substrate having a to-be-etched region; depositing and patterning an etch stop layer; depositing and patterning metal and via layers to form an MEMS structure, the MEMS structure including an isolation region between MEMS parts, an isolation region exposed upwardly, and an isolation region exposed downwardly, wherein the isolation region exposed downwardly is in contact with the etch stop layer; masking the isolation region exposed upwardly, and removing the isolation region between MEMS parts; and removing the etch stop layer.

Abstract: The present invention provides a micromachined sensor. The micromachined sensor includes a proof mass movable with respect to a substrate. The proof mass includes a first portion, a second portion separated from the first portion and a third portion connecting the first portion to the second portion. A frame is positioned on the substrate and encloses the proof mass. A plurality of springs connects the proof mass to the frame. A plurality of first and second electrodes extends from the frame. A plurality of third electrodes extends from the first portion of the proof mass and is interleaved with the first electrodes. A plurality of fourth electrodes extends from the second portion of the proof mass and is interleaved with the second electrodes. A first support beam extends from the frame to the area between the first and second portions of the proof mass. A plurality of seventh and eighth electrodes extends from the first support beam.

Abstract: An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

Abstract: An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.