Abstract: An exposed tube cold plate structure includes a plate body and a water cooling tube. The plate body is formed with a groove. The water cooling tube is pressed and inlaid in the groove. The water cooling tube has a water cooling tube passage for a working medium to flow through. The water cooling tube passage has a passage inner wall. Multiple raised bodies and multiple channels are annularly alternately disposed on the passage inner wall for greatly enlarging the contact area between the passage inner wall and the working medium. In addition, the working medium flows through the water cooling tube passage in a state of turbulent flow so as to enhance the heat exchange amount of the cold plate.

Abstract: A heat sink structure includes a plurality of radiation fins and a base. Each of the radiation fins has a connecting end and a free end, and internally defines a chamber extended between the connecting end and the free end for filling a working fluid therein. The base has an upper connecting surface provided with a plurality of connecting sections and a lower heat receiving surface in contact with a heat source. The connecting ends of the radiation fins are integrally connected to the connecting sections of the base in one-to-one correspondence through overmolding, so as to eliminate thermal resistance between the radiation fins and the base.

Abstract: A CPU and heat sink mounting arrangement including a CPU shell mounted on a printed circuit board in a vertical position, a heat sink attached to one side of the CPU shell, a fan mount covered on the heat sink and fastened to the CPU shell to hold the heat sink in place, and a plurality of plug shafts respectively inserted through respective through holes on the fan mount and the heat sink into respective oval mounting holes on the CPU shell and then turned through a limited angle to force respective oval locating plates thereof into engagement with the oval mounting holes of the CPU shell.