Patents by Inventor Chuan Xie

Chuan Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240405882
    Abstract: Some examples described herein provide for controlling output modulation amplitude for optoelectronic devices. In an example, a method includes transmitting a data pattern to an optical modulator device. The method also includes identifying, for each heater control value of a plurality of heater control values for a heater thermally coupled with the optical modulator device, an optical modulation amplitude corresponding to the heater control value based on a corresponding photodiode current value identified while transmitting the data pattern. The method also includes determining a maximum optical modulation amplitude for the optical modulator device based on a plurality of optical modulation amplitudes corresponding to the plurality of heater control values according to the identifying. The method also includes controlling the heater based at least in part on the determined maximum optical modulation amplitude that has been modified according to scaling maximum photodiode current values.
    Type: Application
    Filed: June 5, 2023
    Publication date: December 5, 2024
    Inventors: Adebabay M. BEKELE, Mayank RAJ, Chuan XIE, Sandeep KUMAR, Zhaowen WANG, Sukruth PATTANAGIRI GIRIYAPPA, Parag UPADHYAYA, Yohan FRANS
  • Publication number: 20240396638
    Abstract: Some examples described herein provide for controlling output modulation amplitude for optoelectronic devices. In an example, a method includes transmitting a first data pattern to an optical modulator device. The method also includes determining, while transmitting the first data pattern and for each heater control value of a plurality of heater control values for a heater, a photodiode current value associated with the optical modulator device to generate a plurality of photodiode current values corresponding to the plurality of heater control values. The method also includes determining a maximum optical modulation amplitude for the optical modulator device based at least in part on the plurality of photodiode current values corresponding to the plurality of heater control values. The method also includes controlling the heater for the optical modulator device based on the maximum optical modulation amplitude.
    Type: Application
    Filed: May 26, 2023
    Publication date: November 28, 2024
    Inventors: Adebabay M. BEKELE, Mayank RAJ, Chuan XIE, Sandeep KUMAR, Zhaowen WANG, Sukruth PATTANAGIRI GIRIYAPPA, Parag UPADHYAYA, Yohan FRANS
  • Publication number: 20240369864
    Abstract: A silicon-on-insulator (SOI) dense-wavelength-division-multiplexing (DWDM) device includes micro-ring modulators (MRMs) having radii under 5 micrometers. A 16-channel embodiment may provide a free spectral range of 3.2 THz, 200 GHz channel spacing, 41 GHz bandwidth, and a Q factor of 4500. PN junctions of rib ring waveguides (RWRs) may be perpendicular or parallel with a plane of the RWRs. On-chip inductive components may be used to match reactances of the PN junctions. The RWRs may be relatively wide and a rib bus waveguide may be relatively narrow (e.g., narrower than the RWRs). MRM outer slaps may be wider than inner slabs. Regions inside and outside of the RWRs, including slabs at optical coupling gaps may be doped to improve modulation efficiency. Regions of the rib bus waveguide distant from the optical coupling gaps may be undoped. Cavities may be provided below the MRMs and associated heater elements.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 7, 2024
    Applicant: XILINX, INC.
    Inventors: Chuan XIE, Mayank RAJ, Anish JOSHI, Zakriya MOHAMMED, Gareeyasee SAHA, Parag UPADHYAYA, Yohan FRANS
  • Publication number: 20240329329
    Abstract: A method of fabricating a chip package is provided, and a chip package fabricated using the same are provided. The method includes connecting a photonic die to a substrate of the chip package and attaching a protection apparatus to the substrate. The method also includes attaching a photonic connector to the photonic die. At least a portion of the photonic connector is disposed inside a housing of the protection apparatus. A fabrication process is performed on the chip package while the photonic connector is inside the housing. After processing, the photonic connector is removed from the housing.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Inventors: Gamal REFAI-AHMED, Chuan Xie, Chi-Yi Chao, Suresh Ramalingam, Nagadeven Karunakaran, Ferdinand F. Fernandez
  • Patent number: 12072239
    Abstract: An integrated circuit (IC) device includes a controller circuitry having an input coupled to a photodiode of an optoelectronic circuitry and an output coupled to a heater of the optoelectronic circuitry, the controller circuitry configured to determine a center frequency of the optoelectronic circuitry based on a shape of an input signal received from the photodiode, and provide a heater signal to the heater based on the shape of the input signal and the center frequency of the optoelectronic circuitry.
    Type: Grant
    Filed: March 30, 2023
    Date of Patent: August 27, 2024
    Assignee: XILINX, INC.
    Inventors: Zhaowen Wang, Mayank Raj, Chuan Xie, Sandeep Kumar, Muqseed Mohammad, Sukruth Pattanagiri Giriyappa, Stanley Y. Chen, Parag Upadhyaya, Yohan Frans
  • Patent number: 11769710
    Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: September 26, 2023
    Assignee: XILINX, INC.
    Inventors: Gamal Refai-Ahmed, Suresh Ramalingam, Ken Chang, Mayank Raj, Chuan Xie, Yohan Frans
  • Patent number: 11668874
    Abstract: Disclosed herein is an optical filter configured for wavelength division and multiplexing capable of transmitting and receiving signals. The optical filter includes an optical waveguide configured to receive at an input multiple signals with different wavelengths. The optical filter includes a plurality of channels coupled at different locations along a length of the optical waveguide. Each of the plurality of channels is configured to transmit a respective one of the multiple signals. A number of ring filter stages in a first channel of the plurality of channels that is closer to the input of the optical waveguide is greater than a second channel in the plurality of channels further away from the input of the optical waveguide.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: June 6, 2023
    Assignee: XILINX, INC.
    Inventors: Zhaoyin Daniel Wu, Chuan Xie, Mayank Raj, Parag Upadhyaya
  • Publication number: 20210305127
    Abstract: Some examples described herein provide for a heterogeneous integration module (HIM) that includes a thermal management apparatus. In an example, an apparatus (e.g., a HIM) includes a wiring substrate, a first component, a second component, and a thermal management apparatus. The first component and the second component are communicatively coupled together via the wiring substrate. The thermal management apparatus is in thermal communication with the first component and the second component. The thermal management apparatus has a first thermal energy flow path for dissipating thermal energy generated by the first component and has a second thermal energy flow path for dissipating thermal energy generated by the second component. The first thermal energy flow path has a lower thermal resistivity than the second thermal energy flow path.
    Type: Application
    Filed: March 27, 2020
    Publication date: September 30, 2021
    Inventors: Gamal REFAI-AHMED, Suresh RAMALINGAM, Ken CHANG, Mayank RAJ, Chuan XIE, Yohan FRANS
  • Publication number: 20210293579
    Abstract: A rotational position detection device includes: a rotary body including first and second magnet pairs respectively including first and second permanent magnets and third and fourth permanent magnets which have polarities different from each other and are arranged adjacent to each other in a predetermined rotation direction; and a sensor pair including first and second magnetic sensors adjacent to each other in the predetermined rotation direction and configured to output different output signals for detection of magnetic fields having different polarities. The rotational position detection device is configured to detect first and second facing positions where the first and second magnetic sensors respectively face the first and second permanent magnets and the third and fourth permanent magnets by a combination of the output signals.
    Type: Application
    Filed: February 22, 2021
    Publication date: September 23, 2021
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: CHUAN XIE, HISAYASU MASE
  • Patent number: 11107770
    Abstract: An improved chip package, and methods for fabricating the same are provided that utilize two tier packaging of an optical die and another die commonly disposed over a substrate. In one example, a chip package is provided that includes an optical die, a core die, and an electrical/optical interface die are all disposed over a common substrate. In one example, a first routing region is provided between the core and electrical/optical interface dies, a second routing region is provided between the electrical/optical interface die and the optical dies, and a third routing region is disposed between the substrate and the core and electrical/optical interface dies.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: August 31, 2021
    Assignee: XILINX, INC.
    Inventors: Suresh Ramalingam, Kun-Yung Chang, Yohan Frans, Chuan Xie, Mayank Raj
  • Patent number: 11005572
    Abstract: Examples described herein generally relate to a temperature-locked loop for optical elements. In an example, a device includes a controller and a digital-to-analog converter (DAC). The controller includes a DC-controllable transimpedance stage (DCTS), a slicer circuit, and a processor. The DCTS is configured to be coupled to a photodiode. An input node of the slicer circuit is coupled to an output node of the DCTS. The processor has an input node coupled to an output node of the slicer circuit. The DAC has an input node coupled to an output node of the processor and is configured to be coupled to a heater. The processor is configured to control (i) the DCTS to reduce a DC component of a signal on the output node of the DCTS and (ii) an output voltage on the output node of the DAC, both based on a signal output by the slicer circuit.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: May 11, 2021
    Assignee: XILINX, INC.
    Inventors: Ping Chuan Chiang, Mayank Raj, Chuan Xie, Stanley Y. Chen, Sandeep Kumar, Sukruth Pattanagiri, Parag Upadhyaya, Yohan Frans
  • Patent number: 10922616
    Abstract: Systems, methods, and computer-readable media are disclosed for determining recommended sizes of products using a machine learning model.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: February 16, 2021
    Assignee: Amazon Technologies, Inc.
    Inventors: Chang Liu, Chuan Xie
  • Publication number: 20200403706
    Abstract: An apparatus and method for generating a dense wavelength division and multiplexing (DWDM) optical stream in a photonic integrated circuit (PIC) is disclosed. An optical input source including a number (N) of optical channels (wavelengths) may be separated (de-interleaved) into multiple optical streams, each including a corresponding subset of the optical channels of the optical input source. Each of the multiple split optical streams may be modulated with an associated set of data streams by silicon-based micro-ring modulators to generate a corresponding modulated optical stream. A first pair of the modulated optical streams may be combined (interleaved) to generate a first optical output stream including N/2 modulated optical channels, and a second pair of the modulated optical streams may be combined (interleaved) to generate a second optical output stream including N/2 modulated optical channels.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Inventor: Chuan XIE
  • Patent number: 10861077
    Abstract: A recommendation system increases the diversity of item recommendations provided to a target user by using machine learning to generate rules for identifying cross-category collections of items. For example, a first machine learning technique can be used to generate combination rules, representing categories of items frequently bought together, and these rules can be applied to generate a listing of cross-category seed item-recommended item pairs. These item pairs can be passed through a set of validation rules, generated by a second machine learning technique and representing correlations between attributes of items frequently bought together, to generate a confidence score representing the likelihood that a customer will want to purchase those two items together. The confidence score can be based on correlating one or more of color, price, seasonality, freshness, brand affinity, customer reviews, or item detail page views of the two items.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: December 8, 2020
    Assignee: Amazon Technologies, Inc.
    Inventors: Chang Liu, Chuan Xie
  • Patent number: 10862588
    Abstract: An apparatus and method for generating a dense wavelength division and multiplexing (DWDM) optical stream in a photonic integrated circuit (PIC) is disclosed. An optical input source including a number (N) of optical channels (wavelengths) may be separated (de-interleaved) into multiple optical streams, each including a corresponding subset of the optical channels of the optical input source. Each of the multiple split optical streams may be modulated with an associated set of data streams by silicon-based micro-ring modulators to generate a corresponding modulated optical stream. A first pair of the modulated optical streams may be combined (interleaved) to generate a first optical output stream including N/2 modulated optical channels, and a second pair of the modulated optical streams may be combined (interleaved) to generate a second optical output stream including N/2 modulated optical channels.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: December 8, 2020
    Assignee: XILINX, INC.
    Inventor: Chuan Xie
  • Patent number: 8526811
    Abstract: A photodiode array includes a plurality of monitoring photodiodes capable operating in a voltage mode configuration each able to provide a voltage indicating an intensity of an incident light. Integrated with the monitoring photodiodes is a reference diode configured to produce reference voltages in response to reference currents supplied to that diode. The monitoring photodiodes and the reference diode may be integrated and have the same current-voltage characteristics and the same temperature, for example by fabricating them on the same substrate. The reference diode is supplied with the reference currents in dark manner, meaning without incident light impinging on the reference diode. The resulting reference voltages, the reference source currents, and the measured photo-voltage from the monitoring photodiodes are than used to determine an optical power value at any temperature within the operation temperature range.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: September 3, 2013
    Assignee: Sumitomo Electric Device Innovations, U.S.A., Inc.
    Inventors: Chuan Xie, Jiaxi Kan, Dennis Burke, Daniel Zhu
  • Publication number: 20130142520
    Abstract: When a high data rate optical signal travels through a fiber link, its high frequency components tend to experience higher losses due to fiber dispersion (modal and/or chromatic). The loss of high frequency components causes the optical eye to close and the sensitivity to degrade. Disclosed is an apparatus and method for an optical transmitter that relies on anti-causal pre-emphasis to counteract the effect of relaxation oscillation, and therefore brings improvements to optical eye symmetry and mask margin (MM).
    Type: Application
    Filed: June 30, 2008
    Publication date: June 6, 2013
    Inventor: Chuan Xie
  • Patent number: 8189642
    Abstract: A vertical surface emitting laser having a mesa structure formed with sloping side walls. A passivation layer including at least two sublayers at least partially covers the mesa structure. The at least two sublayers have differing stress components arranged to at least partially counter each other. By making the mesa structure with sloping side walls, the deposition of the passivation layer in such a way as to minimize the net stress of the passivation layer is facilitated. In addition, the mesa structure has a first stack of mirror layers comprising a semiconductor material doped with a first dopant and having first peripheral oxidized portions extending a first distance into said first stack, and a second stack of mirror layers comprising a semiconductor material doped with a second dopant and having second peripheral oxidized portions extending a second distance into said second stack, wherein the first distance is different from the second distance.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: May 29, 2012
    Assignee: Emcore Corporation
    Inventors: Nein-Yi Li, Chuan Xie, Chun Lei, Richard F. Carson
  • Patent number: 7961770
    Abstract: A power monitoring system uses a low loss reflective element to partially split the output laser beams from an array of laser sources, in a parallel configuration, to produce a monitor beams for each laser source. Each of these monitor beams may propagate within the reflective element in a lossless manner under total internal reflection and into one of a plurality of photodiodes that sense an optical characteristic such as output beam intensity, where this sensed signal is then used as part of a feedback control to control operation of the laser sources in the array.
    Type: Grant
    Filed: March 17, 2010
    Date of Patent: June 14, 2011
    Assignee: Emcore Corporation
    Inventors: Daniel Zhu, Jason O'Neil, Chuan Xie, Dennis Burke, Jiaxi Kan, Gary Basey
  • Publication number: 20110091207
    Abstract: A photodiode array includes a plurality of monitoring photodiodes capable operating in a voltage mode configuration each able to provide a voltage indicating an intensity of an incident light. Integrated with the monitoring photodiodes is a reference diode configured to produce reference voltages in response to reference currents supplied to that diode. The monitoring photodiodes and the reference diode may be integrated and have the same current-voltage characteristics and the same temperature, for example by fabricating them on the same substrate. The reference diode is supplied with the reference currents in dark manner, meaning without incident light impinging on the reference diode. The resulting reference voltages, the reference source currents, and the measured photo-voltage from the monitoring photodiodes are than used to determine an optical power value at any temperature within the operation temperature range.
    Type: Application
    Filed: October 20, 2009
    Publication date: April 21, 2011
    Applicant: EMCORE CORPORATION
    Inventors: Chuan Xie, Jiaxi Kan, Dennis Burke, Daniel Zhu