Patents by Inventor Chuan Yar Lai
Chuan Yar Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11434354Abstract: The present disclosure includes a composition that includes an ethylene/?-olefin random copolymer having density of 0.890 g/cm3 or less, a melting point of 100° C. or less, and a melt index from 0.2 g/10 min to 8.0 g/10 min, a styrenic block copolymer comprising from 1 wt % to less than 50 wt % units of styrene, a tackifier, and an oil. The composition may exhibit an overall melt index of the composition of from 2 g/10 min to 15 g/10 min. The composition can be used as an adhesive in some embodiments. The present disclosure also includes multilayer films that include the composition, which may provide reclose functionality to the multilayer film. The multilayer films that include the composition may provide low initial opening force and improved reclose adhesion through multiple reclose cycles. The present disclosure also includes various types of reclosable packaging articles that include the multilayer films and adhesive compositions.Type: GrantFiled: September 19, 2018Date of Patent: September 6, 2022Assignees: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Xiaosong Wu, Chuan-Yar Lai, Daniel W. Himmelberger, Vivek Kalihari, Cristina Serrat, Vinita Yadav
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Patent number: 11098183Abstract: A composition comprising an ethylene-based polymer which comprises the following properties: a) MWD(conv) from 3.0 to 7.0; b) an ADF IR between 0.230 and 0.260 for molecular weight ?15,000 g/mol c) 12 from 4.0 to 6.5 g/10 min.Type: GrantFiled: February 27, 2018Date of Patent: August 24, 2021Assignee: Dow Global Technologies LLCInventors: Teresa P. Karjala, Jose Ortega, Lori L. Kardos, David T. Gillespie, John N. Naumovitz, Chuan Yar Lai, Zachary L. Polk
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Publication number: 20210108053Abstract: A composition comprising an ethylene-based polymer which comprises the following properties: a) MWD(conv) from 3.0 to 7.0; b) an ADF IR between 0.230 and 0.260 for molecular weight ?15,000 g/mol c) 12 from 4.0 to 6.5 g/10 min.Type: ApplicationFiled: February 27, 2018Publication date: April 15, 2021Applicant: Dow Global Technologies LLCInventors: Teresa P. Karjala, Jose Ortega, Lori L. Kardos, David T. Gillespie, John N. Naumovitz, Chuan Yar Lai, Zachary L. Polk
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Patent number: 10870714Abstract: Disclosed herein is a cast film comprising a polyethylene composition comprising the reaction product of ethylene and optionally one or more alpha-olefin comonomers, wherein said polyethylene composition is characterized by the following properties: a melt index, I2, measured according to ASTM D1238 (2.16 kg, 190° C.), of from 1 to 20 g/10 min; a density (measured according to ASTM D792) of from 0.935 to 0.970 g/cm3; a melt flow ratio, I10/I2, wherein I10 is measured according to ASTM D1238 (10 kg, 190° C.) of from 5.5 to 7.0; a molecular weight distribution (Mw/Mn) of from 2.2 to 3.5; and a vinyl unsaturation of greater than 0.12 vinyls per one thousand carbon atoms present in the backbone of the composition.Type: GrantFiled: January 25, 2017Date of Patent: December 22, 2020Assignee: Dow Global Technologies LLCInventors: Rajen M. Patel, Jacquelyn A. Degroot, Fabricio Arteaga Larios, Selim Bensason, Teresa P. Karjala, Mehmet Demirors, Chuan Yar Lai
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Publication number: 20200354111Abstract: A reclosable package (600) includes a container (602) having an elongate closure region (610) proximate to one edge (608) of the container and bounded on both ends by edge seal regions (620). The closure region includes a reclosable film (630) that seals the container proximate to the edge of the container and has an initial opening strength less than a seal strength of the edge seal regions. Application of an opening force to the reclosable film that is greater than the initial opening strength of the reclosable film may be operable to separate the reclosable film and expose a first reclose surface and a second reclose surface. Contact of the first reclose surface with the second reclose surface and application of a pressure to the reclosable film may be operable to re-adhere the first reclose surface and second reclose surface at a reclose strength.Type: ApplicationFiled: September 21, 2018Publication date: November 12, 2020Applicant: Dow Global Technologies LLCInventors: Vivek Kalihari, Chuan-Yar Lai, Erica Spiekermann, Cristina Serrat, Ronald Wevers, Marc S. Black, Chad V. Schuette, Piyush Soni, Daniel S. Woodman
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Publication number: 20200354112Abstract: The present disclosure is directed to reclosable packages comprising a front wall, a rear wall, and a closure region proximate to an outer edge of the container opposite a bottom of the container. The closure region includes a plurality of seal regions forming a continuous seal between the front wall and the rear wall across a width of the package and at least one of the seal regions is nonlinear. The closure region further includes at least one unsealed region defined between the seal regions. In some reclosable packages, the application of an opening force proximate to the closure region is operable to break the continuous seal between the front wall and the rear wall across a width of the package. The seal geometry may be tuned to adjust the magnitude of opening force required.Type: ApplicationFiled: September 20, 2018Publication date: November 12, 2020Applicants: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Vivek Kalihari, Chuan-Yar Lai, Erica Spiekermann, Cristina Serrat, Marc S. Black, Daniel S. Woodman, Chad V. Schuette, Piyush Soni, Xiaosong Wu, Daniel W. Himmelberger, Vinita Yadav
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Publication number: 20200216649Abstract: The present disclosure includes a composition that includes an ethylene/?-olefin random copolymer having density of 0.890 g/cm3 or less, a melting point of 100° C. or less, and a melt index from 0.2 g/10 min to 8.0 g/10 min, a styrenic block copolymer M comprising from 1 wt % to less than 50 wt % units of styrene, a tackifier, and an oil. The composition may exhibit an overall melt index of the composition of from 2 g/10 min to 15 g/10 min. The composition can be used as an adhesive in some embodiments. The present disclosure also includes multilayer films that include the composition, which may provide reclose functionality to the multilayer film. The multilayer films that include the composition may provide low initial opening force and improved reclose adhesion through multiple reclose cycles. The present disclosure also includes various types of reclosable packaging articles that include the multilayer films and adhesive compositions.Type: ApplicationFiled: September 19, 2018Publication date: July 9, 2020Applicants: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Xiaosong Wu, Chuan-Yar Lai, Daniel W. Himmelberger, Vivek Kalihari, Cristina Serrat, Vinita Yadav
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Publication number: 20200216225Abstract: The present disclosure is directed to a reclosable package comprises a front wall, a rear wall, and an upper closure. At the upper closure, at least a portion of a surface of the rear wall is sealed to an exterior surface of the front wall at a first adhesion strength. According to embodiments, the application of a force greater than the first adhesion strength to the rear wall in a direction away from the front wall is operable to separate the portion of a surface of the rear wall from the exterior surface of the front wall. After, the return of the portion of the surface of the rear wall and an application of a force on the rear wall in the direction of the front wall is operable to reseal the portion of the interior surface of the rear wall to the exterior surface of the front wall.Type: ApplicationFiled: September 21, 2018Publication date: July 9, 2020Applicants: Dow Global Technologies LLC, Rohm and Haas CompanyInventors: Vivek Kalihari, Chuan-Yar Lai, Erica Spiekermann, Cristina Serrat, Marc S. Black, Daniel S. Woodman, Chad V. Schuette, Piyush Soni, Xiaosong Wu, Daniel W. Himmelberger, Vinita Yadav, Bruno Rufato Pereira
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Publication number: 20190112459Abstract: The present invention relates to polymer blends, to films comprising one or more layers formed from such polymer blends, and to packages. In one aspect, a polymer blend comprises a polyethylene, nanocellulose, wherein the nanocellulose comprises 0.5 to 5 weight percent of the blend based on the total weight of the blend, and maleic anhydride-grafted polyethylene, wherein the maleic anhydride-grafted polyethylene comprises 0.5 to 5 weight percent of the blend based on the total weight of the blend.Type: ApplicationFiled: May 4, 2017Publication date: April 18, 2019Inventors: Chuan Yar Lai, Arnaldo T. Lorenzo, Cristina Serrat
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Patent number: 10239676Abstract: The present disclosure is directed to compositions and film structures suitable for heat seal production. The heat sealable flexible film structure includes: a layer (A) comprising a blend comprising from 35 to 80 percent by weight of the layer (A) of a propylene based plastomer or elastomer (“PBPE”) and from 20 to 65 percent by weight of the layer (A) of a low density polyethylene having a density in the range of from 0.915 g/cm3 to 0.935 g/cm3, wherein the blend has a melt index (as determined according to ASTM D 1238 (at 190° C./2.16 Kg); a layer (B), adjacent to layer (A), comprising a polyolefin-based polymer, wherein the polymer or polymer blend which makes up layer (B) flows more easily than the blend of layer (A) under conditions intended for making a hard seal with the film structure; and an outermost layer (C) comprising a material having a melting point greater than 140° C.; wherein the ratio of the thickness of layer (B) to the thickness of layer (A) is 3:1 or greater.Type: GrantFiled: October 10, 2014Date of Patent: March 26, 2019Assignee: Dow Global Technologies LLCInventors: Chuan Yar Lai, Kurt Brunner, Jozef J.i. Van Dun, Nicolas C. Mazzola, Maria Isabel Arroyo Villan
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Publication number: 20190002602Abstract: Disclosed herein is a cast film comprising a polyethylene composition comprising the reaction product of ethylene and optionally one or more alpha-olefin comonomers, wherein said polyethylene composition is characterized by the following properties: a melt index, I2, measured according to ASTM D1238 (2.16 kg, 190° C.), of from 1 to 20 g/10 min; a density (measured according to ASTM D792) of from 0.935 to 0.970 g/cm3; a melt flow ratio, I10/I2, wherein I10 is measured according to ASTM D1238 (10 kg, 190° C.) of from 5.5 to 7.0; a molecular weight distribution (Mw/Mn) of from 2.2 to 3.5; and a vinyl unsaturation of greater than 0.12 vinyls per one thousand carbon atoms present in the backbone of the composition.Type: ApplicationFiled: January 25, 2017Publication date: January 3, 2019Inventors: Rajen M. Patel, Jacquelyn A. Degroot, Fabricio Arteaga Larios, Selim Bensason, Teresa P. Karjala, Mehmet Demirors, Chuan Yar Lai
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Publication number: 20160244229Abstract: The present disclosure is directed to compositions and film structures suitable for heat seal production. The heat sealable flexible film structure includes: a layer (A) comprising a blend comprising from 35 to 80 percent by weight of the layer (A) of a propylene based plastomer or elastomer (“PBPE”) and from 20 to 65 percent by weight of the layer (A) of a low density polyethylene having a density in the range of from 0.915 g/cm3 to 0.935 g/cm3, wherein the blend has a melt index (as determined according to ASTM D 1238 (at 190° C./2.16 Kg); a layer (B), adjacent to layer (A), comprising a polyolefin-based polymer, wherein the polymer or polymer blend which makes up layer (B) flows more easily than the blend of layer (A) under conditions intended for making a hard seal with the film structure; and an outermost layer (C) comprising a material having a melting point greater than 140° C.; wherein the ratio of the thickness of layer (B) to the thickness of layer (A) is 3:1 or greater.Type: ApplicationFiled: October 10, 2014Publication date: August 25, 2016Inventors: Chuan Yar Lai, Kurt Brunner, Jozef J.i. Van Dun, Nicolas C. Mazzola, Maria Isabel Arroyo Villan